SMT, PCB Electronics Industry News

SMT, PCB Electronics Industry News

News from Siemens Corporation

SIPLACE innovations successful at trade and technology shows

May 06, 2009

The presentations of technology leader Siemens Electronics Assembly Systems (SEAS) at regional trade shows like APEX in Las Vegas, Nepcon in Shanghai and SMY/Hybrid/Packaging in Nuremberg, Germany confirm that the company has set the right course for the future. While the SIPLACE MultiStar CPP head was honored with the EM Asia Innovation Award and the SMT China Vision Award within only one month, the "sneak previews" of the SIPLACE SX in Asia and the U.S. with their live demonstrations of gantry replacements draw plenty of interest and positive feedback. With its concept of "capacity on demand", the SIPLACE SX is definitely the answer to today's electronics manufacturers' need for more efficient production concepts with ever more frequent product changeovers and demand fluctuations.

The SIPLACE SX lets them invest in exactly what they need, when they need it. With its innovative products and its new, flexible organization, SEAS is perfectly positioned for the challenges of the future.

During SEAS's presentations at the APEX, Nepcon Shanghai and SMT/Hybrid/Packaging trade shows, visitors showed great interest in SIPLACE's new MultiStar CPP head, which was honored with the EM Asia Innovation Award and the SMT China Vision Award at the Nepcon Shanghai 2009 show. Technology experts and show visitors were equally impressed by the head's ability to adapt to virtually all new electronics manufacturing requirements and to automatically synchronize entire production lines. It accomplishes this by combining for the first time the speed of Collect & Place technology for components as small as 01005 with the versatility of Pick & Place technology for components as large as 50 x 40 mm. The result: even more flexible and powerful line and placement concepts.

Highlight at Nuremberg's SMT/Hybrid/Packaging: On-site portal replacement

Especially popular were the live demonstrations of the so-called "portal replacement" with the brand-new SIPLACE SX. With this placement machine, the SIPLACE team offers electronics manufacturers entirely new production concepts and significantly more efficient responses to ever more frequent product changeovers and demand fluctuations. While traditional machine concepts require cumbersome additions and removals of entire machine modules, the SIPLACE SX achieves the same with replaceable, pre-calibrated gantries. During their live presentations, the SIPLACE experts demonstrated that these gantries can even be replaced in less than the anticipated 30 minutes. That way, placement capacity and performance can be easily synchronized or transferred between lines in accordance with fluctuation demand.

Bernhard Fritz, the SIPLACE team's product marketing manager, was very satisfied with the visitors' acceptance of SIPLACE's offerings already on the first day of the SMT/Hybrid/Packaging: "We knew that our new machine would generate lots of attention, but that the interest and particularly the feedback would be this positive makes us very proud. The new SIPLACE SX and SIPLACE CPP MultiStar are clearly the show's highlights, but as a result of the current market situation visitors are also very interested in our 'economic stimulus packages' for the SIPLACE D-Series."

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