FL250D is a low voiding, no-clean solder paste specifically designed for maximum robustness in reflow profiling and stencil printing. Capable of fine feature printing with Type 3 (-325/+500 mesh) powder at print speeds up to 200 mm/sec (8 in/sec) along with a wide process window and long idle times makes the FL250D the premium paste choice for high- and low-volume manufacturing alike.
�This approval is further proof that Kester has become the premier solder paste supplier in terms of offering products that prevent and/or eliminate the head-in-pillow defect,� said Tony Longo, Kester's Global Product Manager for solder paste. �Kester's in-depth understanding of the mechanism that causes head-in-pillow defects has allowed Kester's Research and Development team to develop best-in-class paste products that help solve our customers issues and meet their most pressing needs.�
For more information about Kester's FL250D including test protocol and product application, contact Kester by phone at (+1) 630-616-4000 or 800-2-KESTER (53-7837), or by e-mail at email@example.com. Kester's Web site may be found at http://www.kester.com.
Founded in 1899, Kester is a world-renowned supplier of solder and related materials and services to the electronics assembly and micro-processor assembly markets. Kester is known for high quality, advanced technology and superior technical support. With headquarters in Itasca, IL, Kester has manufacturing facilities in the United States, Mexico, Singapore, Germany, Japan, Taiwan, Malaysia and China. Its worldwide manufacturing and technical capabilities provide the support required to serve major electronics manufacturing services providers and OEMs.