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SMTA South East Asia Technical Conference on Electronics Assembly Technologies Call for Presentations Announced

Apr 23, 2009

MINNEAPOLIS, MN � The SMTA is pleased to announce its latest technical event in Penang, Malaysia. The SMTA South East Asia Technical Conference on Electronics Assembly Technologies will be held November 19-20, 2009 at the Equatorial Hotel in Penang, Malaysia. Presentations are currently being solicited for the following key technology tracks:

Assembly

  • Lean Manufacturing

  • Low volume / Prototype assembly

  • Medical electronic

  • Rework and repair of QFNs

  • Selective Soldering

  • Set up reduction

  • Vapor phase reflow for high reliability assemblies

  • Yield Improvement

  • Under fill Applications and issues

Components

  • Chip scale packages, including WL-CSP, LGA

  • Multichip packages, including 3D packaging

  • Tin Whiskers

Emerging Technologies

  • Embedded Technology/ Actives and Assembly

  • Optoelectronics

  • Solar Technology

  • System in a Package

  • Power and Thermal Management

Harsh Environment Applications

  • Lead Free issue for Harsh environments

  • Potting

  • Conformal Coating

PCB Technology

  • Black pad and surface finish defects

  • Halogen Free, ROHS, Green products requirements

Abstracts (300 words) are due June 19, 2009. The abstract and presentation must be non-commercial in nature and emphasize the technology and not the company portfolio. Full contact information and a presentation title must be included with the abstract submission. Abstracts can be uploaded online at:

http://www.smta.org/education/education.cfm#asia_pacific

Contact the Conference Coordinator, Melissa Serres Marx, with questions or comments.

The SMTA membership is an international network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies, including microsystems, emerging technologies, and related business operations.

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