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Fine Line Stencil's UltraSlic FG Solder Paste Stencil Win a 2009 EMAsia Innovation Award

Apr 23, 2009

Fine Line Stencil, a division of FCT Assembly and a leading manufacturer of stencil products, announces that it has been awarded a 2009 EMAsia Innovation Award in the category of Assembly Line Systems/Equipment for its UltraSlic FG solder paste stencil. The award was presented to the company during an April 22, 2009 ceremony that took place at The Foyer outside the Grand Ballroom of the Shanghai Everbright International Hotel during Nepcon China 2009.

FINE LINE STENCIL's new UltraSlic FG solder paste stencil is the latest breakthrough in stencil technology. With superior paste release below surface area ratios of 0.5, UltraSlic FG outperforms all existing stencil technologies on the market today. Using the latest stencil laser technology and Datum Alloys' new Fine Grain stencil material, exclusively distributed by Ed Fagan, Inc., UltraSlic FG stencils provide superior aperture registration, higher performance and lower cost compared to electroform, the option of step stencils, and the option of same day turnaround times.

Established in 2006, EM Asia Innovation Awards program strives to recognize and celebrate excellence in the Asian electronics industry, inspiring companies to achieve the highest standards and push the industry forward. For more information, please visit http://www.emasiamag.com/awards2009.

For additional information, please contact Derek Stuart at (719) 579-8055 x111 or visit http://www.finelinestencil.com.

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