SMT, PCB Electronics Industry News
  • SMTnet
  • »
  • Industry News
  • »
  • Fine Line Stencil's UltraSlic FG Solder Paste Stencil Win a 2009 EMAsia Innovation Award

Fine Line Stencil's UltraSlic FG Solder Paste Stencil Win a 2009 EMAsia Innovation Award

Apr 23, 2009

Fine Line Stencil, a division of FCT Assembly and a leading manufacturer of stencil products, announces that it has been awarded a 2009 EMAsia Innovation Award in the category of Assembly Line Systems/Equipment for its UltraSlic FG solder paste stencil. The award was presented to the company during an April 22, 2009 ceremony that took place at The Foyer outside the Grand Ballroom of the Shanghai Everbright International Hotel during Nepcon China 2009.

FINE LINE STENCIL's new UltraSlic FG solder paste stencil is the latest breakthrough in stencil technology. With superior paste release below surface area ratios of 0.5, UltraSlic FG outperforms all existing stencil technologies on the market today. Using the latest stencil laser technology and Datum Alloys' new Fine Grain stencil material, exclusively distributed by Ed Fagan, Inc., UltraSlic FG stencils provide superior aperture registration, higher performance and lower cost compared to electroform, the option of step stencils, and the option of same day turnaround times.

Established in 2006, EM Asia Innovation Awards program strives to recognize and celebrate excellence in the Asian electronics industry, inspiring companies to achieve the highest standards and push the industry forward. For more information, please visit http://www.emasiamag.com/awards2009.

For additional information, please contact Derek Stuart at (719) 579-8055 x111 or visit http://www.finelinestencil.com.

Sep 28, 2011 -

Fine Line Stencil Announces Online Special

Dec 17, 2009 -

Fine Line Stencil Aligns with Advanced Tooling Design

Nov 05, 2009 -

Fine Line Stencil Appointed as DEK Stencil Franchisee

Mar 18, 2009 -

Fine Line Stencil to Premier UltraSlic FG Solder Paste Stencil at APEX 2009

Mar 12, 2008 -

Fine Line Stencil to Premier New Technologies and Company Updates at APEX 2008

Aug 19, 2017 -

See Latest Dispense Technology Demonstrations From GPD Global at NEPCON 2017

Aug 17, 2017 -

ZESTRON Americas Announces New Regional Sales Manager

Aug 17, 2017 -

SEHO Soldering Expert to Discuss Resource & Cost Efficient Wave Soldering at SMTAI

Aug 17, 2017 -

Libra Industries Announces Two 20-Year Service Awards in Q2 2017

Aug 17, 2017 -

Cirtronics Installs High-Performance X-ray Inspection Solution

Aug 17, 2017 -

Essemtec to Show New All-in-One Jetting / Placement System at SMTAI

Aug 17, 2017 -

Engineered Material Systems to Introduce New Conductive Adhesives for Stringing and Shingling Next-Generation Solar Modules at EU PVSEC

Aug 17, 2017 -

What is SMT and where to by SMT spare parts

Aug 16, 2017 -

ViTrox and KIC Establish Cooperation and Connectivity

Aug 16, 2017 -

Inovaxe Is Making Storage SMARTER – Visit Booth #915 at SMTAI

See electronics manufacturing industry news »

Fine Line Stencil's UltraSlic FG Solder Paste Stencil Win a 2009 EMAsia Innovation Award news release has been viewed 846 times

  • SMTnet
  • »
  • Industry News
  • »
  • Fine Line Stencil's UltraSlic FG Solder Paste Stencil Win a 2009 EMAsia Innovation Award
Selective Conformal Coating System - GPD SimpleCoat

reflow oven profiler