SMT, PCB Electronics Industry News
  • SMTnet
  • »
  • Industry News
  • »
  • Volunteers Honored for Contributions to IPC and Electronics Industry Fifty Awards Presented at IPC APEX EXPO�

Volunteers Honored for Contributions to IPC and Electronics Industry Fifty Awards Presented at IPC APEX EXPO�

Apr 15, 2009

BANNOCKBURN, Ill., USA, April 1, 2009 � IPC � IPC � Association Connecting Electronics Industries� presented Special Recognition, Distinguished Committee Leadership and Distinguished Committee Service awards at IPC APEX EXPO 2009, held March 31�April 2 in Las Vegas.

The awards were presented to individuals who made significant contributions to IPC and the electronics manufacturing industry by lending their time and expertise to standards development committees and program development.

Special Recognition award recipients were:

  • Floyd Bertagnolli, STM, for his contributions to the wire splicing training video, DVD-61C.

  • Mike Bixenman, Kyzen Corporation, for his leadership in organizing the IPC/SMTA Cleaning Conference held October 2008.

  • Curtis Grosskopf, IBM Corporation, for his contributions to J-STD-075, Classification of Non-IC Electronic Components for Assembly Processes.

Distinguished Committee Leadership awards went to:

  • Steven Martell, Sonoscan Inc., for his leadership of the IPC B-10A Task Group and the joint ECA/IPC/JEDEC Working Group that developed J-STD-075, Classification of Non-IC Electronic Components for Assembly Processes.

  • Jack McCullen, Intel Corporation and Paul Krystek, IBM Corporation, for their leadership of the joint ECA/IPC/JEDEC Working Group that developed J-STD-075.

  • Darrin Dodson, Alcatel-Lucent, for leadership of the 7-31b Task Group that developed IPC-A-610DC, Telecom Addendum.

  • Michael Hill, Colonial Circuits, Inc., for leadership of the 7-32c Electrical Continuity Task Group that helped develop IPC-9252A, Requirements for Electrical Testing of Unpopulated Printed Boards.

  • G. Sidney Cox, E.I. du Pont de Nemours and Co. and Michael Luke, Raytheon Company, for their leadership of the D-53 Embedded Device Performance Subcommittee that helped develop IPC-6017, Qualification and Performance Specification for Printed Boards Containing Embedded Passive Devices.

  • Renee Michalkiewicz, Trace Laboratories � East and John Rohlfing, Delphi Electronics and Safety, in recognition of their leadership of the 5-24a Flux Specification Task Group that developed J-STD-004B, Requirements for Soldering Fluxes.

  • Gerard O'Brien, Solderability Testing and Solutions, Inc. and Michael Freda, Sun Microsystems Inc., for their leadership of the D-32 Thermal Stress Test Method Subcommittee that helped develop the new IPC-TM-650, Method 2.6.27, Thermal Stress, Convection Reflow Assembly Simulation.

  • Vern Solberg, Solberg Technical Consulting, for leadership of the 5-21g Flip Chip Mounting Strategy Task Group that developed IPC-7094, Design and Assembly Process Implementation for Flip Chip and Die Size Components.

  • Valerie St. Cyr, Teradyne Inc., for her leadership in the development of �Embedded Passives: An Overview of Implementation, Benefits and Costs,� an IPC White Paper.

Distinguished Committee Service awards were presented to:

  • Werner Engelmaier, Engelmaier Associates, L.C.; Gerald Leslie Bogert, Bechtel Plant Machinery Inc. and Joseph Smetana, Alcatel-Lucent, for their contributions to J-STD-075, Classification of Non-IC Electronic Components for Assembly Processes.

  • William Dieffenbacher, BAE Systems Platform Solutions; Don Dupriest, Lockheed Martin Missiles and Fire Control; Timothy Estes, Conductor Analysis Technologies, Inc.; Gary Long, Intel Corporation.; Ronald Rhodes, Conductor Analysis Technologies, Inc.; Valerie St. Cyr, Teradyne Inc.; Vicka White, Honeywell Inc. Air Transport Systems; Dewey Whittaker, Honeywell Inc. Air Transport Systems and David Wolf, Conductor Analysis Technologies, Inc., for their contributions to the IPC-PCQR� database program for benchmarking of printed board fabricator capability.

  • Steven Smith, Fujitsu Network Communications, and Jennifer Day, for their contributions to the IPC-A-610DC, Telecom Addendum.

  • Alan Exley, Raytheon Company; Guy Ferraro, Beamind; Michael Green, Lockheed Martin Space Systems Company; Clifford Maddox, Boeing Company and Adelino Sousa, MicroCraft K.K., for their contributions to IPC-9252A, Requirements for Electrical Testing of Unpopulated Printed Boards.

  • David Adams, Rockwell Collins; Hue Green, Lockheed Martin Space Systems Company; Helen Holder, Hewlett-Packard Company; David Sbiroli, Indium Corporation of America; David Scheiner, Kester; Karen Tellefsen, Cookson Electronics; Dung Tiet, Lockheed Martin Space Systems Company and Brian Toleno, Henkel Corporation, for contributions to J-STD-004B, Requirements for Soldering Fluxes.

  • Timothy Estes, Conductor Analysis Technologies, Inc.; Clifford Maddox, Boeing Company; Chris Mahanna, Robisan Laboratory, Inc.; Michael Paddack, Boeing Company; Vicka White, Honeywell Inc. Air Transport Systems and Dewey Whittaker, Honeywell Inc. Air Transport Systems, for their contributions to IPC-TM-650, Method 2.6.27, Thermal Stress, Convection Reflow Assembly Simulation.

  • Werner Engelmaier, Engelmaier Associates, L.C., for his contributions to IPC-7094, Design and Assembly Process Implementation for Flip Chip and Die Size Components.

For more information on these awards and the award recipients, contact Anna Garrido, IPC director of marketing and communications, at +1 847-597-2804 or AnnaGarrido@ipc.org.

About IPC IPC (www.IPC.org) is a global trade association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its 2,700 member companies which represent all facets of the electronics industry, including design, printed board manufacturing, electronics assembly and test. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $1.5 trillion global electronics industry. IPC maintains additional offices in Taos, N.M.; Arlington, Va.; Garden Grove, Calif.; Stockholm, Sweden; and Shanghai, China.

Jun 20, 2017 -

Zentech Manufacturing, Inc. First to Recertify for IPC Qualified Manufacturers Listing

Jun 14, 2017 -

IPC Submits Comments to Trump Administration Regarding Modernization of NAFTA

Jun 07, 2017 -

IPC Hand Soldering Competition Winner Crowned at SMT Hybrid Packaging 2017

Jun 01, 2017 -

North American PCB Order Growth Pushes Book-to-Bill Ratio Higher

May 16, 2017 -

IPC Report Details How PCB Manufacturers Meet Current and Future Technology Demands

May 15, 2017 -

Taiwan Union Technology Corporation Receives the First IPC-4101 Qualified Products Listing Certification

May 15, 2017 -

IPC to Host Fourth Annual Reliability Forum in Germany

May 04, 2017 -

Electronics Industry Leaders Meet with Members of Congress and Leaders of Trump Administration Executives urge policymakers to support pro-manufacturing policies

May 04, 2017 -

IPC Welcomes New Senior Director of Learning and Professional Development

May 03, 2017 -

North American PCB Order Growth Boosts Book-to-Bill Ratio

832 more news from Association Connecting Electronics Industries (IPC) »

Jun 25, 2017 -

Libra Industries’ Christopher R. Howell Memorial Foundation Awards $20,000 in Scholarships during Annual Golf Outing

Jun 25, 2017 -

SHENMAO Exhibits at IMAPS System in Package June 27-28, 2017 Introducing 3 New Semiconductor Packaging Fluxes

Jun 25, 2017 -

Ersa Brings the ‘Little Big One’ to SMTA Ohio – Award-Winning Selective Solder

Jun 25, 2017 -

Optimal Electronics Releases Process Control and Traceability Solution for Nordson ASYMTEK Applications in Clean Rooms for Sensor Assembly

Jun 25, 2017 -

Inovaxe Partners with Repstronics in Mexico

Jun 22, 2017 -

PNC Inc. Invests in LED Laser Direct Imaging system from Miva Technologies

Jun 22, 2017 -

Addressing The Modulation of Light Output -- High Quality LED Manufacturing

Jun 22, 2017 -

Schleuniger, Inc. Receives 2017 Best of Manchester Award

Jun 21, 2017 -

Inovar Inc. Breaks Ground for New Facility on USU Innovation Campus

Jun 21, 2017 -

PNC Inc. Launches Design Webinar Series

See electronics manufacturing industry news »

Volunteers Honored for Contributions to IPC and Electronics Industry Fifty Awards Presented at IPC APEX EXPO� news release has been viewed 1048 times

  • SMTnet
  • »
  • Industry News
  • »
  • Volunteers Honored for Contributions to IPC and Electronics Industry Fifty Awards Presented at IPC APEX EXPO�
PCB Cleaning

Reflow Ovens thermal process improvement