�It was our best show in the 10 years of SPEA America,� added Buhrkuhl. �All of us were constantly busy with customers � we now have a lot of work to do!�
Likewise, Tim Kardish, CEO, APS Novastar, and his staff will be busy following up on �high quality customer inquiries.� He added, �IPC effectively matched workshop and conference content to attendee needs for these challenging times. We look forward to participating in 2010.�
A valuable part of the educational content which continues to draw great interest from attendees is the Poster Paper Sessions. This year's Best Poster award went to Scott Hinaga of Cisco Systems, Inc. for Effect of Conductor Surface Roughness upon Measured Loss and Extracted Values of PCB Laminate Material Dissipation Factor. Honorable Mention was presented to John Kuhn of Dielectric Solutions, LLC, along with co-authors Russell Dudek, Compunetics Inc., and Patricia Goldman of Dielectric Solutions, LLC, for Opening Eyes on Fiber Weave and CAF.