Apr 13, 2009
Kester 979 VOC-Free No-Clean Liquid Flux is a completely new, organic, no-clean flux formulation for high quality, low-defect soldering of electronic circuit board assemblies. Its chemistry is free of any volatile organic compounds (VOCs), solvents that may react photochemically to form air pollution (smog). This flux's finely tuned activation system offers the best wetting available in VOC-Free liquid flux technology and the shiniest solder joints. Kester 979 offers excellent soldering properties that lead to higher productivity without sacrificing reliability of the assembly. Kester 979 also reduces microsolderballing on glossy laminates and between connector pins.
Kester 985M Lead-Free No-Clean Alcohol-Based Flux is specially designed to improve effectiveness in the wave soldering of conventional circuit board assemblies. This flux was developed for excellent solderability and through-hole fill in lead-free wave soldering process. 985M minimizes micro-solderballing at connectors and CPU. Its residue left behind is non-tacky, non-corrosive and non-conductive.
The EnviroMark 907 is truly the world's first Global Lead-Free Solder Paste that is being used on every manufacturing continent. Since its introduction, the EnviroMark 907 has been refined to be the most reproducible lead-free solder paste available. Kester's technology team has improved the product tremendously since its launch. The improvements have been made through a series of process design initiatives. Kester's refinements in its raw materials and manufacturing processes have led to continuously improved field performance, now unsurpassed in the industry.
Kester's EnviroMark 828 Lead-Free Water-Soluble Solder Paste is billed as a breakthrough in water-soluble technology with the combination of low voiding, excellent wetting behavior and ease of cleaning. The paste promises best in class BGA voiding performance together with best in class solderability, joint appearance and shininess. It produces consistent solder paste volume deposits regardless of idle time, stencil life and print speed, and post-soldering residues are easily removed in a standard DI aqueous cleaning process. EnviroMark 828 also promises excellent print definition and bridging prevention thanks to its non-slumping chemistry.
K100LD represents an improvement over competitive alloys, including other variations of Tin-Copper-Nickel (SnCuNi). K100LD is a low-cost (silver-free) lead-free alloy primarily containing tin and copper with the inclusion of metallic dopants to control the grain structure and the Copper dissolution rate. K100LD has a slower rate of Copper dissolution than competitive SnCuNi alloys, which minimizes pot maintenance, maintains consistent soldering performance and improves reliability. K100LD has a copper dissolution rate 20 percent slower than the competitive SnCuNi alloy and even Sn63Pb37. K100LD compares favorably to other low-cost, lead-free alloys of tin and copper in terms of wetting and flow characteristics, providing users with optimal soldering performance and minimal defects.
For more information about Kester's full line of products and services, contact Kester by phone at (+1) 630-616-4000 or 800-2-KESTER (53-7837), or by e-mail at customerservice@kester.com. Kester's Web site may be found at http://www.kester.com.
Founded in 1899, Kester is a world-renowned supplier of solder and related materials and services to the electronics assembly, micro-component, and industrial soldering markets. Kester is known for high quality, advanced technology and superior technical support. With headquarters in Itasca, IL, Kester has additional manufacturing facilities in the United States, Mexico, Canada, Singapore, Germany, Japan, Brazil, Taiwan, Malaysia and China. Its worldwide manufacturing and technical capabilities provide the support required to serve major electronics manufacturing services providers and OEMs.
