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KIC's Brian O'Leary to Host Webinar Series on FAQ Topics

Apr 08, 2009

San Diego � April 2009 � KIC, the leader of thermal process development and control products, and winner of multiple industry awards, announces that Brian O'Leary, Sales Manager � Americas will host a series of three free Webinars throughout 2009. The topics of the Webinars will focus on providing solutions to common issues.

The first Webinar,�Reduce/Eliminate Product Changeover for the Reflow Process, will be held Friday, May 15, 2009 at 1 p.m. PST. It will last 30 minutes and discuss how to consolidate multiple profiles under one or more oven recipes.� �We have worked with dozens of OEMs and CMs that had many dozens of profiles over multiple lines,� said O'Leary.��We have developed a fairly robust approach that allows for a great deal of profile consolidation that not only maintains the integrity of each product's profile, but results in a solution taking the least amount of time.�� For more information, or to join the meeting on May 15, visit The meeting number for this Webinar is 335 157 360.

The next Webinar will take place on June 26, 2009 at 1 p.m. PST. Titled �How to Profile BGAs,� this meeting will last 30 minutes and will highlight ways of successfully profiling BGAs. BGAs are becoming ever more difficult to properly reflow due to a whole host of industry changes, such as�their relative thermal mass to other components, their relative position to other components on denser populated boards, differences in conductive materials�such as ceramics�and the tightening of overall reflow specs due to lead-free conversion.�All of these new demands leave little room for error, thus�the need for high-quality profiles.�During this Webinar, KIC will discuss various techniques for reliability profiling BGAs, such as a thermocouple attachment.�Also�discussed will be some groundbreaking methods of BGA inspection, using the profiling process as one more tool in your arsenal to create a more robust inspection regiment for BGAs.�For more information, or to join the meeting on June 26, visit The meeting number for this Webinar is 331 436 382�.

The final Webinar in the series, How to Use Less Energy in Reflow While Maintaining Throughput and an In-Spec Process, will be held on September 25, 2009 at 1 p.m. PST and will last 30 minutes. It is possible to lower the amount of energy required to produce an in-spec profile while not sacrificing throughput and product quality.�During this meeting, KIC will share the results of several studies on this topic and methodology to how you can start turning down the thermostat and save money. For more information, or to join the meeting on September 25, visit The meeting number for this Webinar is 336 789 255.

Based in San Diego, KIC is the industry leader in automated thermal management tools and systems for reflow, wave, cure and semiconductor thermal processes. The company pioneered the development of oven profilers and process development tools, and then worked to create the next generation of thermal systems to help manufacturers optimize and monitor thermal processes.

In addition to KIC Explorer, products include the KIC�24/7 continuous monitoring system, the KIC Vision automatic profiling system and more. With the introduction of cutting edge tools, the company continues to stay on the leading edge of process optimization and real-time thermal management systems, and has won numerous industry awards.

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