SMT, PCB Electronics Industry News

SMT, PCB Electronics Industry News

News from Finetech

FINETECH to Demonstrate Advanced Rework Applications at APEX 2009

Mar 18, 2009

FINETECH will demonstrate today's most requested advanced rework applications in booth #2059 at the upcoming APEX 2009, scheduled to take place March 31 � April 2, 2009 at the Mandalay Bay Convention Center in Las Vegas.

FINETECH's rework machines in the booth will focus on three areas:

Residual solder removal is used for site dressing after the removal of SMD components or for clea�ning BGA interposers before reballing. In a single sweep, molten solder is�easily removed from the board by powerful vacuum, and an innovative solder removal head allows contactless residual solder removal without disturbing pads or solder resist.

Direct component paste printing showing a simple and reproducible method integrated directly into the rework tool. This one process step provides an all-in-one solution for reworking MLF and QFN leadless components. These components are often incorporated into area-sensitive products and do not provide any solder coating, thus requiring new solder paste to be applied during the rework process.

Reballing to restore�BGAs and CSPs back to original condition. The component is first pre-cleaned to remove defective spheres, either singular, multiple or complete arrays. This is accomplished using hot gas bottom/top heating and high-resolution optics in conjunction with excellent thermal management.


FINETECH is a leading manufacturer of innovative rework and micro assembly equipment for the latest advanced packages. The modular design of the FINEPLACER� platform enables a multitude of applications, from reworking SMDs to the highly accurate placement of flip chips or opto-electronic components. FINETECH is headquartered in Berlin, Germany, with offices in Tempe, Arizona, Shanghai, China and Penang, Malaysia.

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