SMT, PCB Electronics Industry News

FINETECH to Demonstrate Advanced Rework Applications at APEX 2009

Mar 18, 2009

FINETECH will demonstrate today's most requested advanced rework applications in booth #2059 at the upcoming APEX 2009, scheduled to take place March 31 � April 2, 2009 at the Mandalay Bay Convention Center in Las Vegas.

FINETECH's rework machines in the booth will focus on three areas:

Residual solder removal is used for site dressing after the removal of SMD components or for clea�ning BGA interposers before reballing. In a single sweep, molten solder is�easily removed from the board by powerful vacuum, and an innovative solder removal head allows contactless residual solder removal without disturbing pads or solder resist.

Direct component paste printing showing a simple and reproducible method integrated directly into the rework tool. This one process step provides an all-in-one solution for reworking MLF and QFN leadless components. These components are often incorporated into area-sensitive products and do not provide any solder coating, thus requiring new solder paste to be applied during the rework process.

Reballing to restore�BGAs and CSPs back to original condition. The component is first pre-cleaned to remove defective spheres, either singular, multiple or complete arrays. This is accomplished using hot gas bottom/top heating and high-resolution optics in conjunction with excellent thermal management.


FINETECH is a leading manufacturer of innovative rework and micro assembly equipment for the latest advanced packages. The modular design of the FINEPLACER� platform enables a multitude of applications, from reworking SMDs to the highly accurate placement of flip chips or opto-electronic components. FINETECH is headquartered in Berlin, Germany, with offices in Tempe, Arizona, Shanghai, China and Penang, Malaysia.

Apr 07, 2016 -

Finetech/Martin Introducing New Rework and Dispense Solutions at IPC APEX 2016

Nov 27, 2013 -

Martin Streamlines and Simplifies Rework with New Process Shuttle

Nov 08, 2013 -

Finetech Unveils High Force ACF Bonder

May 28, 2013 -

Al Cabral Joins Finetech as Regional Sales Manager

Mar 11, 2013 -

Donated Finetech Die Bonder Installed at Pennsylvania State University

Jan 16, 2013 -

Finetech to Exhibit the Ideal Blend of Performance and Cost Rework Technology at the 2013 IPC APEX EXPO

Jan 04, 2013 -

Finetech to Exhibit Sub-micron Die Bonder at SPIE Photonics West

Oct 03, 2012 -

The Best in Rework Technology – Finetech to Exhibit FINEPLACER® Core Rework System at SMTA International

Sep 26, 2012 -

MARTIN to Demonstrate Mini-Oven Reball/PreBump Unit at the Mississauga EPTECH Electronics Show

Sep 10, 2012 -

MARTIN to Participate in Package on Package (PoP) Design and Assembly Center SMTA International 2012

76 more news from Finetech »

Sep 21, 2017 -

Logic PD Sponsoring, Exhibiting at American Medical Device 2017

Sep 20, 2017 -

Viscom AG adopts Valor Process Preparation solution for electronics manufacturing efficiency

Sep 20, 2017 -


Sep 20, 2017 -

New IPC Studies Show World PCB Market Up in 2016 as North American Market Shrinkage Slows World PCB Production and Annual North American PCB Industry Reports Released

Sep 20, 2017 -

ADLINK Technology invites clients to join the MEC Congress 2017

Sep 19, 2017 -

ASC International to Highlight 3D AOI/SPI Innovations at SMTA International

Sep 19, 2017 -

MicroCare Presents Radically Innovative ‘Greener’ Cleaning Fluid at Parts2Clean Stuttgart Hall 3 Stand A46

Sep 19, 2017 -

Aegis Software’s FactoryLogix a major step on Melecs journey towards Industry 4.0

Sep 19, 2017 -

IPC Invites Industry Leaders to Submit Poster Abstracts for IPC APEX EXPO 2018 in San Diego

Sep 19, 2017 -

SCS Webinar to Address the Use of Parylene for Increased Reliability

See electronics manufacturing industry news »

FINETECH to Demonstrate Advanced Rework Applications at APEX 2009 news release has been viewed 674 times