FINETECH's rework machines in the booth will focus on three areas:
Residual solder removal is used for site dressing after the removal of SMD components or for clea�ning BGA interposers before reballing. In a single sweep, molten solder is�easily removed from the board by powerful vacuum, and an innovative solder removal head allows contactless residual solder removal without disturbing pads or solder resist.
Direct component paste printing showing a simple and reproducible method integrated directly into the rework tool. This one process step provides an all-in-one solution for reworking MLF and QFN leadless components. These components are often incorporated into area-sensitive products and do not provide any solder coating, thus requiring new solder paste to be applied during the rework process.
Reballing to restore�BGAs and CSPs back to original condition. The component is first pre-cleaned to remove defective spheres, either singular, multiple or complete arrays. This is accomplished using hot gas bottom/top heating and high-resolution optics in conjunction with excellent thermal management.
FINETECH is a leading manufacturer of innovative rework and micro assembly equipment for the latest advanced packages. The modular design of the FINEPLACER� platform enables a multitude of applications, from reworking SMDs to the highly accurate placement of flip chips or opto-electronic components. FINETECH is headquartered in Berlin, Germany, with offices in Tempe, Arizona, Shanghai, China and Penang, Malaysia.