SMT, PCB Electronics Industry News

SMT, PCB Electronics Industry News

News from Fine Line Stencil, Inc.


Fine Line Stencil to Premier UltraSlic FG Solder Paste Stencil at APEX 2009

Mar 18, 2009

Fine Line Stencil, a division of FCT Assembly and a leading manufacturer of stencil products, announces it will introduce the UltraSlic™ FG solder paste stencil, which sets new stencil performance standards, in booth 846 at the upcoming APEX 2009 exhibition & conference, scheduled to take place March 31-April 2, 2009 in Las Vegas.

Fine Line Stencil's new UltraSlic FG solder paste stencil is the latest breakthrough in stencil technology. With superior paste release below surface area ratios of 0.5, UltraSlic FG outperforms all existing stencil technologies on the market today. Using the latest stencil laser technology and Datum Alloys' new Fine Grain stencil material, exclusively distributed by Ed Fagan, Inc., UltraSlic FG stencils provide superior aperture registration, higher performance and lower cost compared to electroform, the option of step stencils, and the option of same day turnaround times.

UltraSlic™ FG Standard 304/301SS

The two photos show the differences between regular stainless steel and UltraSlic FG on etched apertures. As illustrated, much finer features and smoother walls are achieved with UltraSlic FG than with standard 304 or 301SS.

"OEMs and contract manufacturers are faced with ever-increasing challenges as assemblies get more and more complex. With the introduction of our new UltraSlic FG stencil, we are able to offer cost-effective solutions for the most challenging designs. At prices 20-50 percent less than electroform, our customers can now get the performance they need while reducing their overall cost," said Robert Dervaes, V.P. Technology and Engineering for FINE LINE STENCIL.

For additional information, contact Derek Stuart at (719) 579-8055 x111, visit http://www.finelinestencil.com or stop by booth 846 at APEX 2009.

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