SMT, PCB Electronics Industry News

SMT, PCB Electronics Industry News

News from DEK International


DEK Gives APEX Attendees Look at Future-Proofed Technologies

Mar 17, 2009

From DEK booth #2412 at this year's APEX event, being held over March 31 � April 2 in Las Vegas, Nevada, visitors will witness the ultimate in product versatility and choice for a truly future-proofed investment and productivity advantage.

Renowned for its exceptional value and performance, DEK's Horizon platform now offers manufacturers more choice and upgradeability options than ever before, delivering an unprecedented Return on Investment. With 2.0 Cpk and 6 Sigma production performance, DEK's Horizon portfolio, which includes the Horizon 01i, Horizon 02i and Horizon 03i, provides superior operation as standard. Now, however, assembly specialists can also choose from a host of options that are all completely retrofittable in the field. The ability to select advanced technologies such as high performance automatic board support, exceptionally fast print verification and high throughput understencil cleaning if and when a process dictates such additions is a tremendous competitive advantage. And, of course, all of these options are controlled using DEK's award-winning touch-screen user interface, Instinctiv V9. Visitors to the DEK booth will be able to see many of these technologies on-board the Horizon 01i and Horizon 03i platforms.

In keeping with the company's philosophy of technology leadership, which includes delivering robust systems with a commitment to low cost of ownership, DEK will also show several new advances that deliver precisely such a proposition. To address footprint optimization and capital expenditure challenges, DEK will debut a new

printer-adaptable dispensing technology that can add dispense functionality to existing printer platforms. The system, called Stinger�, simply integrates into the print system, allowing the printer platform to perform as an automatic dispensing system. Following screen printing of the PCB, the Stinger module can then dispense paste or adhesive using industry standard cartridges, saving dramatically on time and equipment investment cost. Other technologies on show from booth #2412 will include DEK's Verification and Traceability software, which helps reduce overhead through elimination of manual cross-checking procedures and improved quality monitoring, as well as the next-generation advance of DEK's market-leading enclosed head deposition system, ProFlow�.

Of course, it's not only systems that ensure process success. Expertise, know-how and high performance inputs are essential to a high-yield outcome. At APEX 2009, DEK's expert staff will present free seminars, running at 11:00 a.m. and 2:00 p.m. daily at the company's booth, that highlight proven effective and efficient production techniques. The seminar and display will include the latest information on stencil advances, including DEK's award-winning VectorGuard portfolio, and real-world examples that illustrate the positive impact an optimized print platform can have on the bottom line. In addition, show delegates will have the opportunity to evaluate our new understencil cleaning fabric and chemistries and test for themselves the impact high performance products can have on defect reduction.

As a market leader that participates in the global electronics industry, DEK is very cognizant of the challenges today's economic climate poses to its customers and partners. The company firmly believes it has a responsibility to provide not just effective solutions for current hurdles, but forward-looking technologies that allow electronics firms to be nimble and adaptable for future requirements. This philosophy is evident throughout DEK's product and service portfolio and the company invites industry specialists to visit booth #2412 at APEX or log onto http://www.dek.com to find out how this commitment can enable process success.

About DEK

DEK is a global provider of advanced materials deposition technologies and support solutions including printing equipment platforms, stencils, precision screens and mass imaging processes used across a wide range of applications in electronics pre-placement subassembly, semiconductor wafer manufacture, and alternative energy component production. For more information, visit DEK at http://www.dek.com.

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