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Seika Machinery to Introduce 3-D High Precision Solder Paste Inspection System at APEX 2009

Mar 10, 2009

TORRANCE, CA � January 2009 � Seika Machinery, Inc., a leading provider of advanced machinery, materials and engineering services, announces that it will premier Anritsu, a new 3-D High Precision Laser In-Line Solder Paste Inspection System in booth 1035 at the upcoming APEX 2009 exhibition and conference, scheduled to take place March 31-April 2, 2009, in Las Vegas.

The system features numerous advanced technology features including ultra-high resolution: horizontal (10 �m/20 �m interchangeable) and vertical (1 �m, best in class), high-speed inspection (33 sq cm/sec at 20 �m resolution; 13.8 sq cm/sec at 10 �m resolution), and easy programming and maintenance in that program generation is accomplished in approximately five minutes and consistent results are provided, regardless of the operator.

Additionally, the system offers many benefits to users such as an automatic calibration function for easy maintenance, SPC software that is included as standard for detailed analysis and traceability, and reliable and accurate zero plane reference points.

For more information about the solder paste inspection system, stop by Seika Machinery's booth 1035 at APEX 2009.

About Seika Machinery, Inc.

Seika Machinery, Inc. (SMI) is a subsidiary of Seika Corporation, Japan and member of the Mitsubishi Global Group. SMI provides electronics manufacturers with advanced machinery, superior materials and engineering services.

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