This task group is gathering new information for possible additional amending of revision C of J-STD-006, �Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications.� This is a meeting between people that are part of the J-STD-006 group. The meeting is being held to discuss any forthcoming changes to the J-STD-006 specification.
David Scheiner is the current chairman of the J-STD-006 working committee. The J-STD-006 standard prescribes the nomenclature, requirements and test methods for electronic grade solder alloys; for fluxed and non-fluxed bar, ribbon, and powder solders, for electronic soldering applications; and for �special� electronic grade solders. The committee is currently working on updating the sections of the document addressing lead-free solder alloys.
At the IPC Spring Meeting at APEX/EXPO Mr. Scheiner will be receiving a Distinguished Committee Service Award. He will be receiving the award��In appreciation and recognition for contributions in the development of IPC J-STD-004B, Requirements for Soldering Fluxes.�
For more information about the task group or to view the schedule of events, please visit http://www.goipcshows.org.
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