Micro-engineered to expertly meet the challenges of fine-pitch printing, VectorGuard Platinum is an enabling stencil platform ideal for advanced applications such as wafer level packaging, direct chip attach, flip chip and ball grid arrays (BGAs),. Capable of delivering aperture accuracies of less than 3μm, and positional tolerances of better than 20μm at pitches down to 50 μm, VectorGuard Platinum's novel stencil manufacturing process enables optimal process efficiency by generating high accuracy paste transfer and consistent paste volume repeatability.
DEK's latest product launch represents the first time the company's Platinum customers have been able to take advantage of the patented frameless VectorGuard stencil system. Designed for print process optimization and first pass yield, the lightweight and compact technology offers simple and automatic tensioning, independent of traditional pneumatic assistance processes. Delivering enhanced positional accuracy, stencil lifetime, storage convenience, improved rigidity, safer handling and breakthrough ease-of-use, the VectorGuard system extends manufacturing flexibility through an extensive selection of diverse foil technologies including VectorGuard Silver for optimal lead-free printing and VectorGuard PumpPrint� for cost-effective adhesive deposition.
�Fast becoming an industry-standard technology, VectorGuard is renowned for its manufacturing flexibility in every environment � from standard SMT to lead-free. The launch of VectorGuard Platinum means it is now even more flexible, opening up a distinct competitive advantage for semiconductor customers,� explains DEK's Michael Zahn. �Supporting a high throughput level to help our customers achieve more into the future,VectorGuard Platinum is first choice for semiconductor specialists who want the most accurate print capability and tightest process control.�
DEK is a global provider of advanced materials deposition technologies and support solutions including printing equipment platforms, stencils, precision screens and mass imaging processes used across a wide range of applications in electronics pre-placement subassembly, semiconductor wafer manufacture, and alternative energy component production. For more information, visit DEK at http://www.dek.com.