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Indium Corporation Technical Engineers' Papers Accepted by IPC Lead-Free Conference

Feb 15, 2009

Indium Corporation's Senior Technical Support Engineer Mario Scalzo and Technical Support Engineer Ed Briggs had their papers accepted for presentation at the IPC/JEDEC Conference, Transitioning to Lead Free � Strategies for Implementation, in Santa Clara, California, March 3-5, 2009. Both Mario and Ed are based at Indium's global headquarters in Clinton, NY.

Mario's paper, Addressing the Challenge of Head-in-Pillow Defects in Electronics Assembly, discusses the two main sources of head-in-pillow defects and solutions for their elimination. Ed's paper, Optimizing Reflow Profiling Lead-Free SMT Assembly, covers best practices for optimizing the reflow process and trouble shooting of the most common defects. Mario will travel to Santa Clara to present both papers on March 4, 2009.

Sponsored by IPC and JEDEC, this conference contains a full-day technical session plus workshops for those interested in meeting the industry challenge of RoHS compliance and successfully implementing lead-free electronics assembly processes.

Mario joined Indium Corporation in 2000. He holds a bachelor's degree in Chemistry from Saint Anselm College. He also holds a certificate from the American Chemical Society for Professional Education. In addition, he is an SMTA-Certified Process Engineer and has a Six-Sigma Black Belt from Dartmouth College's Thayer School of Engineering. He is also the author of the Electronics Assembly Materials blog, http://www.indium.com/blogs/Mario-Scalzo-Blog/ .

Ed has been with Indium Corporation for over 16 years. He has an associate's degree in Chemical Technology from Mohawk Valley Community College where he earned the Douglas J. Bauer Award for Excellence in Chemistry. He is an SMTA-certified engineer and has earned a Six-Sigma Green Belt Certification from Dartmouth College for demonstrated proficiency in developing and executing design experiments to support continuous process improvement.

Indium Corporation is a premiere materials supplier to the global electronics assembly, semiconductor fabrication and packaging, solar photovoltaic, and thermal management markets. �Founded in 1934, the company offers a broad range of products, services, and technical support focused on advanced materials science. �With facilities in the PRC, Singapore, South Korea, the United Kingdom, and the USA, the company is a four-time Frost & Sullivan Award winner and registered to ISO-9001.

For more information about Indium Corporation, visit http://www.indium.com or email abrown@indium.com.

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