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Indium Corporation Features New Halogen-Free Pb-Free Solder Paste at APEX

Feb 11, 2009

Indium8.9HF Solder Paste is a halogen-free Pb-free solder paste with unsurpassed print transfer efficiency and response-to-pause printing. The advanced rheology of Indium8.9HF is ideally suited for today's advanced 0.4mm pitch and 0201 technologies.

As a truly halogen-free solder paste (tested per EN14582 test method), Indium8.9HF possesses a unique activator package and outstanding oxidation barrier, which allows it to coalesce and wet as good as, or better than, its halogen-containing counterparts. The oxidation barrier also ensures there is no graping on small passives.

Additionally, the combination of outstanding oxidation barrier and high slump resistance allows Indium8.9HF to effectively eliminate head-in-pillow defects.

Indium8.9HF can be manufactured with SnPb powder so it can be used on products currently exempt from RoHS. Using Indium8.9HF in a SnPb process offers high thermal stability and very low voiding in mixed alloy applications. It also eliminates the need to change solder paste chemistry when transitioning to a RoHS-compliant environment.

Overall, Indium8.9HF provides superior performance characteristics that increase customers cost savings and finished goods reliability, while ensuring compliance with REACH, RoHS, and future halogen-restricting legislation.

Indium will be exhibiting at Booth 1273

For more information about Indium8.9HF Halogen-Free Pb-Free Solder Paste, visit http://www.halogen-free.com or email abrown@indium.com.

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