The primary goal of the workshop is to provide a forum of technical exchange regarding experiences, lessons learned, data, and other information on testing of lead-free electronic assemblies.
In June 2008, GEIA-STD-0005-3, Performance Testing for Aerospace and High Performance Electronic Interconnects Containing Pb-free Solder and Finishes was released by the ITAA. This document was one of several deliverables provided by the AIA-GEIA-AMC LEAP Working Group. The document is undergoing update to Revision A and, as part of the update process, additional and new information/data in lead-free testing is of interest.
Prospective authors are encouraged to submit presentations addressing (but not necessarily limited to) the following topics:
- Lessons Learned in Lead-free testing
- Performance data (mechanical, environmental, etc.) of lead-free solders
- Critiques/comparisons of various test approaches/procedures
- New/novel test methods
- Environmental Stress Screening
- Challenges in lead-free testing
- New materials
All submittals must be considered open to the public. No ITAR or proprietary information please.
Submit a one page abstract by Feb 11 to Dr. Michael Osterman. Authors will be notified by February 16st of acceptance. Final presentations will be due on April 3rd.