SMT, PCB Electronics Industry News
  • SMTnet
  • »
  • Industry News
  • »
  • Essemtec Delivers First Series of Newly Developed RO-VARIO Reflow and Curing Ovens

Essemtec Delivers First Series of Newly Developed RO-VARIO Reflow and Curing Ovens

Jan 30, 2009

RO-VARIO, the new developed reflow and curing oven from Essemtec, offers a unique modularity and flexibility for a number of solder and hardness tasks in the electronics and solar engineering industries. The first ovens were delivered to the customers earlier this month.

The first production series of the RO-VARIO, which is expandable up to 14 zones, sold out quickly. In addition to customers in Germany and Austria, companies from India purchased the unique oven. �This shows us that we are not only able to satisfy the requirements of the European customers with the technical concept of the oven, but that the oven will find purchasers in growth markets too. Our technical concept convinces the customers,� said Martin Ziehbrunner, manager of Essemtec AG.

�Since the development of the RO-VARIO, oven modularity and flexibility have been the focus,� commented Joachim Biegel, RO-VARIO product manager. Apart from the number of heating and cooling zones the transport system also is designed in modular system. The RO-VARIO can be used as full convection reflow oven, IR curing oven with special slow forward feed or UV hardness system.

Customers can choose various transport systems. Additionally, to a mesh belt, which has an operation width of 600 mm, the oven can be configured with pin chain drive or as chain over belt. Up to five separate tracks can be fed through the oven at the pin chain drive (e.g., for use in the solar industry or for parallel production of printing boards in a line production). The chain profiles also can be configured as center supports. Using a special shifting system, developed and patented for this use, it is ensured that all tracks and/or center supports will be adjusted individually and automatically to the various transportation widths. Absolute parallelism of the individual tracks is ensured for 14 zone ovens.

In addition to the transport systems, the heating chambers have been redeveloped completely and have been equipped with numerous innovations. Highly efficient heat protection is used, ensuring the highest possible efficiency of energy. A manufacturing technique is used that rivets the heating chambers as opposed to welding them. This technique has proven successful under extreme conditions in other industrial sectors, particularly in the aerospace industry to avoid material tension by different temperatures.

All heating chambers are floating mounted, allowing the chamber to expand without blocking or bending the frame, the cap or the transport system. The chambers only expand in a �controlled length and width.

The complete frame of the cap can be opened parallel including the covering and the heating chambers. This enables easy access from the front and the back to the hearting chambers and the inside of the oven for cleaning and maintenance work. At the same time, RO-VARIO has a small footprint, key for companies with limited space.

The driving system of the fans, placed outside of the �hot zone,� is mounted on the heating chambers. By the use of the unique driving concept and the assembly of a cool environment, MTBF can be minimized by factors. The whole driving process is observed by a sensor that is placed at the driving system of the last chamber.

�Just this feature as well as the easy maintenance of the oven and the appreciation resulting from it explain by customers have chosen the RO-VARIO�, Martin Ziehbrunner concludes.

About the company:

Essemtec is a worldwide leader in the manufacturer of Surface Mount Technology (SMT) production equipment. Essemtec specializes in high mix production equipment for Printed Circuit Boards (PCB) using Surface Mount Technology.

Essemtec is the only manufacturer to cover the entire production process, from Printers and/or Dispensers, to Pick-and-Place and Soldering equipment. Therefore, customers benefit from unparallel knowledge and the ability to select, from a single source, a complete process solution to meet their requirements.

Aug 17, 2017 -

Essemtec to Show New All-in-One Jetting / Placement System at SMTAI

Jul 27, 2017 -

Essemtec to show all-in-one jetting/placement system at SMTA Capital Expo: the perfect NPI machine

Feb 21, 2017 -

Essemtec Wins the 2017 NPI Award for Multifunction Placement for the New FOX2

Jan 11, 2017 -

Essemtec Announces Placement & Jetting in a Single Pass Through with the New FOX2

Nov 21, 2016 -

Juerg Schuepbach Joins Essemtec as International Sales Manager

Oct 13, 2016 -

Essemtec's FOX Offers Hassle-Free Manufacturing of 2.5D Assemblies - Learn More at the Upcoming SMTA Expos

Sep 12, 2016 -

Essemtec Will Demonstrate the Spider Jet Dispenser at IMAPS 2016 in Pasadena

Sep 06, 2016 -

New Compact Pick-and-Place with Linear Motors to be Displayed at SMTA Guadalajara

May 31, 2016 -

Essemtec Brings on Captec to Back Continued Growth in Northern CA and NV

May 02, 2016 -

Bob Stevenson Joins Essemtec USA to Strengthen North American Reach

186 more news from ESSEMTEC »

Sep 24, 2017 -

Europlacer Shows Printer at Productronica India – Just!

Sep 24, 2017 -

Microtronic GmbH Appoints Distributor for the LBT210 & ConTTest Systems in Spain and Portugal

Sep 24, 2017 -

INTERFLUX® Electronics Completes Testing on New Alloy at Ersa Demo Room

Sep 24, 2017 -

CyberOptics Launches Coordinate Measurement Software Suite for New High Speed SQ3000™ CMM System

Sep 21, 2017 -

Logic PD Sponsoring, Exhibiting at American Medical Device 2017

Sep 20, 2017 -

Viscom AG adopts Valor Process Preparation solution for electronics manufacturing efficiency

Sep 20, 2017 -

COT Announces PB Swiss Tools’ Two New INSIDER Models: INSIDER STUBBY and INSIDER STUBBY RATCHET

Sep 20, 2017 -

New IPC Studies Show World PCB Market Up in 2016 as North American Market Shrinkage Slows World PCB Production and Annual North American PCB Industry Reports Released

Sep 20, 2017 -

ADLINK Technology invites clients to join the MEC Congress 2017

Sep 19, 2017 -

ASC International to Highlight 3D AOI/SPI Innovations at SMTA International

See electronics manufacturing industry news »

Essemtec Delivers First Series of Newly Developed RO-VARIO Reflow and Curing Ovens news release has been viewed 776 times

  • SMTnet
  • »
  • Industry News
  • »
  • Essemtec Delivers First Series of Newly Developed RO-VARIO Reflow and Curing Ovens
Reflow Oven

Plasma Prior to Conformal Coating