SMT, PCB Electronics Industry News

SMTAI 2009 Call For Papers Reminder

Jan 23, 2009

2009 Call for Papers, October 4-8, 2009, San Diego, California

You are invited to submit a paper to the electronic industry's premier forum on the manufacture of electronic products utilizing surface mount and related technologies. Papers are sought in the following key technology tracks:

Assembly

  • Adhesives

  • BGA/CSP assembly

  • Cleaning process

  • Connector Technology

  • Design for Excellence

  • Design for Six Sigma

  • Dispensing process

  • Equipment selection

  • Facility layout

  • Flux and solder

  • Land pattern design

  • Lead-free case studies

  • Lead-free soldering

  • Lean manufacturing

  • Low volume / prototype assembly

  • Medical electronics

  • Placement process

  • Printing process

  • Solder paste

  • Reflow soldering

  • Rework and repair of QFNs

  • RFID Assembly

  • Selective soldering

  • Set up reduction

  • Supplier engineering (board assembly)

  • Vapor phase reflow for high reliability assemblies

  • Wave soldering

  • Yield Improvement

Business

  • Capacity modeling

  • Contract manufacturing

  • Design for Success - Remaining Competitive

  • Doing business in China

  • Environmental issues

  • Lean Manufacturing

  • Operations management

  • RoHS Compliance

  • Supplier management

  • Technology roadmaps

  • Total quality management

Components

  • Ball grid arrays

  • Battery interaction

  • Chip scale packages, including WL-CSP

  • Component reliability

  • Component solderability

  • Connectors

  • Direct chip attach (flip chip)

  • Embedded passives

  • Failure analysis

  • Fine pitch technology

  • Harsh environments (automotive, military, space)

  • Lead/termination finish

  • Leadless packaging

  • MultiChip packages, including 3D packaging

  • Tin Whiskers

Emerging Technologies

  • 0201/01005 Components and Assembly

  • Consumer Applications

  • Electronic Printing Technology

  • Embedded Technology / Actives and Assembly

  • "Getters"

  • MEMS/RF, MEMS/MOEMS

  • Nanoelectronics, Reliability of Nanodevices

  • New Materials and Processes

  • Optoelectronics

  • Power or Thermal Management

  • Sensors and Manufacturing

  • Solar Technology

  • System in a Package

  • Thermal Interface Materials

  • Wireless Applications including Bluetooth and Wi-Fi

PCB Technology

  • Black pad and surface finish defects

  • Embedded passive components (capacitors, resistors, inductors)

  • Halogen Free

  • HDI

  • Microvias, filled and unfilled

  • Moisture sensitivity

  • Soldermask

  • Substrate reliability

  • Substrate solderability

  • Surface finish

Process Control

  • Acoustic imaging

  • AOI

  • Computer integrated manufacturing

  • In-circuit test

  • Process modeling

  • Software

  • Test strategies

  • X-ray

SMTA International offers three awards, each worth $1000USD and a recognition plaque: "Best of Conference Presentation", "Best of Proceedings Paper", and "Best International Paper". Additionally, speakers make a contribution to our industry by sharing their research and findings, and they help to advance the industry and are recognized by their colleagues.

Abstracts (300 words) are due March 27, 2009. Proposals are also solicited from individuals interested in teaching educational courses related to surface mount technology, advanced packaging, and electronics manufacturing. Course length may be half-day or full-day, and these proposals must also be submitted by March 27, 2009.

Paper manuscripts and course workbooks are due by July 6, 2009. Papers should be 6-15 pages long (including graphics) and describe significant results from experiments, emphasize new techniques, or contain technical, economic, or appropriate test data. Presentation materials and papers must be original, unpublished, and non-commercial in nature.

Visit smta.org/smtai/call_for_papers.cfm for complete details on SMTA International and to submit your abstract for the 2009 program.

Aug 16, 2017 -

SMTA Capital Expo to Feature Essemtec Fox Pick and Place System

Aug 14, 2017 -

Shannan O’Shaughnessy, GVD Corporation, to Present at SMTA Capital Chapter’s Expo and Tech Forum on August 24

Aug 08, 2017 -

iNEMI’s Bill Bader to Keynote Technical Innovations Symposium at SMTA International

Aug 06, 2017 -

Gerry Partida, Summit Interconnect, to Present at SMTA Capital Chapter’s Expo and Tech Forum on August 24th

Aug 01, 2017 -

Mike Bixenman, KYZEN Corporation, Wins Best of Presentation Award at the 2017 International Conference on Soldering and Reliability (ICSR)

Aug 01, 2017 -

Phil Zarrow, ITM Consulting, to Present at SMTA Capital Chapter’s Expo and Tech Forum on August 24th

Jul 27, 2017 -

International Wafer-Level Packaging Conference (IWLPC) Keynote Presenters Announced

Jul 23, 2017 -

SMTA Welcomes New Board Members

Jul 23, 2017 -

SMTA International Technical Program Expands, Includes Research from HDPUG and AREA Consortium

Jul 19, 2017 -

International Wafer-Level Packaging Conference (IWLPC) Program Announced and Registration Now Open

560 more news from Surface Mount Technology Association (SMTA) »

Aug 19, 2017 -

See Latest Dispense Technology Demonstrations From GPD Global at NEPCON 2017

Aug 17, 2017 -

ZESTRON Americas Announces New Regional Sales Manager

Aug 17, 2017 -

SEHO Soldering Expert to Discuss Resource & Cost Efficient Wave Soldering at SMTAI

Aug 17, 2017 -

Libra Industries Announces Two 20-Year Service Awards in Q2 2017

Aug 17, 2017 -

Cirtronics Installs High-Performance X-ray Inspection Solution

Aug 17, 2017 -

Essemtec to Show New All-in-One Jetting / Placement System at SMTAI

Aug 17, 2017 -

Engineered Material Systems to Introduce New Conductive Adhesives for Stringing and Shingling Next-Generation Solar Modules at EU PVSEC

Aug 17, 2017 -

What is SMT and where to by SMT spare parts

Aug 16, 2017 -

ViTrox and KIC Establish Cooperation and Connectivity

Aug 16, 2017 -

Inovaxe Is Making Storage SMARTER – Visit Booth #915 at SMTAI

See electronics manufacturing industry news »

SMTAI 2009 Call For Papers Reminder news release has been viewed 846 times

PCB machines

ADJUST-A-VAC Vacuum Tweezer for fragile components, wafers, MEMS devices tweezers