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FINETECH to Showcase Chip-to-Wafer Packaging with Sub-Micron Bonder at Photonics West 2009

Jan 16, 2009

FINETECH will showcase chip-to-wafer bonding with the sub-micron placement accuracy FINEPLACER� Femto at the upcoming Photonics West exhibition (booth 519) in San Jose, CA, January 27-29, 2009

The automated, sub-micron alignment capability and large substrate handling of the Femto system allows users to develop advanced chip-to-wafer processes. FINETECH will demonstrate die-to-wafer pre-bonding on spin-coated adhesive. The Femto is capable of many interconnect processes using adhesive, films and solders. Pre-bonding or permanent bonding can be achieved via curing, thermocompression, or thermosonic modules. Placing known good die will reduce costly wafer yield limits, and allow mixed technologies to be integrated for the most advanced 3D integration.

Designed for production environments as well as product and process development, the FINEPLACER� Femto offers exceptionally low cost of ownership. The system marks a breakthrough by combining high accuracy (�0.5 micron) and process flexibility, with the smallest footprint in the market (1270 x 900 mm). Features include a large working area and automatic pattern recognition and alignment based on X, Y, Z and theta movements. Bonding processes are automatically controlled, eliminating operator intervention during the alignment and bonding procedure.

More information is available at

About FINETECH GmbH & Co. KG:

FINETECH is a leading manufacturer of innovative rework and micro assembly equipment for the latest advanced packages. The modular design of the FINEPLACER� platform enables a multitude of applications, from reworking SMDs to the highly accurate placement of flip chips or opto-electronic components. FINETECH is headquartered in Berlin, Germany, with offices in Tempe, Arizona, Shanghai, China and Penang, Malaysia

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