SMT, PCB Electronics Industry News
  • SMTnet
  • »
  • Industry News
  • »
  • FINETECH to Showcase Chip-to-Wafer Packaging with Sub-Micron Bonder at Photonics West 2009

FINETECH to Showcase Chip-to-Wafer Packaging with Sub-Micron Bonder at Photonics West 2009

Jan 16, 2009

FINETECH will showcase chip-to-wafer bonding with the sub-micron placement accuracy FINEPLACER� Femto at the upcoming Photonics West exhibition (booth 519) in San Jose, CA, January 27-29, 2009

The automated, sub-micron alignment capability and large substrate handling of the Femto system allows users to develop advanced chip-to-wafer processes. FINETECH will demonstrate die-to-wafer pre-bonding on spin-coated adhesive. The Femto is capable of many interconnect processes using adhesive, films and solders. Pre-bonding or permanent bonding can be achieved via curing, thermocompression, or thermosonic modules. Placing known good die will reduce costly wafer yield limits, and allow mixed technologies to be integrated for the most advanced 3D integration.

Designed for production environments as well as product and process development, the FINEPLACER� Femto offers exceptionally low cost of ownership. The system marks a breakthrough by combining high accuracy (�0.5 micron) and process flexibility, with the smallest footprint in the market (1270 x 900 mm). Features include a large working area and automatic pattern recognition and alignment based on X, Y, Z and theta movements. Bonding processes are automatically controlled, eliminating operator intervention during the alignment and bonding procedure.

More information is available at http://www.finetechusa.com

About FINETECH GmbH & Co. KG:

FINETECH is a leading manufacturer of innovative rework and micro assembly equipment for the latest advanced packages. The modular design of the FINEPLACER� platform enables a multitude of applications, from reworking SMDs to the highly accurate placement of flip chips or opto-electronic components. FINETECH is headquartered in Berlin, Germany, with offices in Tempe, Arizona, Shanghai, China and Penang, Malaysia

Apr 07, 2016 -

Finetech/Martin Introducing New Rework and Dispense Solutions at IPC APEX 2016

Nov 27, 2013 -

Martin Streamlines and Simplifies Rework with New Process Shuttle

Nov 08, 2013 -

Finetech Unveils High Force ACF Bonder

May 28, 2013 -

Al Cabral Joins Finetech as Regional Sales Manager

Mar 11, 2013 -

Donated Finetech Die Bonder Installed at Pennsylvania State University

Jan 16, 2013 -

Finetech to Exhibit the Ideal Blend of Performance and Cost Rework Technology at the 2013 IPC APEX EXPO

Jan 04, 2013 -

Finetech to Exhibit Sub-micron Die Bonder at SPIE Photonics West

Oct 03, 2012 -

The Best in Rework Technology – Finetech to Exhibit FINEPLACER® Core Rework System at SMTA International

Sep 26, 2012 -

MARTIN to Demonstrate Mini-Oven Reball/PreBump Unit at the Mississauga EPTECH Electronics Show

Sep 10, 2012 -

MARTIN to Participate in Package on Package (PoP) Design and Assembly Center SMTA International 2012

76 more news from Finetech »

Jun 27, 2017 -

Flying Probe, Functional Test & Inline Test – Visit Acculogic at SMTA Ohio Expo

Jun 27, 2017 -

VJ Technologies and Datest Partner in West Coast Inspection Services, Showroom and Demonstration Center.

Jun 26, 2017 -

Altus get SMART with Koh Young’s Innovative New Software

Jun 26, 2017 -

Ersa to Hold Versaflow 3 Level II Maintenance Training Course

Jun 25, 2017 -

Libra Industries’ Christopher R. Howell Memorial Foundation Awards $20,000 in Scholarships during Annual Golf Outing

Jun 25, 2017 -

SHENMAO Exhibits at IMAPS System in Package June 27-28, 2017 Introducing 3 New Semiconductor Packaging Fluxes

Jun 25, 2017 -

Ersa Brings the ‘Little Big One’ to SMTA Ohio – Award-Winning Selective Solder

Jun 25, 2017 -

Optimal Electronics Releases Process Control and Traceability Solution for Nordson ASYMTEK Applications in Clean Rooms for Sensor Assembly

Jun 25, 2017 -

Inovaxe Partners with Repstronics in Mexico

Jun 22, 2017 -

PNC Inc. Invests in LED Laser Direct Imaging system from Miva Technologies

See electronics manufacturing industry news »

FINETECH to Showcase Chip-to-Wafer Packaging with Sub-Micron Bonder at Photonics West 2009 news release has been viewed 615 times

  • SMTnet
  • »
  • Industry News
  • »
  • FINETECH to Showcase Chip-to-Wafer Packaging with Sub-Micron Bonder at Photonics West 2009
StikNPeel™ Rework Stencils

PCB machines