The electronics industry is driven by demands for smaller, better, faster, cheaper, and more ecologically sound product designs. Process engineers are experiencing rapid change as the industry adopts lead-free designs. Additionally, the complexity of assemblies increases with the need to pack more circuitry into smaller spaces. From a reliability standpoint, cleaning is becoming more important.
This session will cover process integration of cleaning materials, and cleaning machines and support required to develop a wide processing window. The panelists will address how users integrate materials to address clean vs. no-clean, lead-free soils, cleaning under tight standoff components, and overcoming compatibility constraints. Attendees will gain an understanding of today's cleaning challenges and how users address those challenges within the manufacturing environment.
For more information about the conference, visit http://www.ipc.org/CleaningConferenceBrochure. Visit http://www.ipc.org/CleaningConfSponsorshipApp for information about the sponsorship application, and http://www.ipc.org/CleaningConfTabletopApp for the tabletop application.