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KIC's MB (Marybeth) Allen to Present Paper at European Electronics Assembly Reliability Summit, Tallinn

Oct 16, 2008

San Diego � October 2008 � KIC, the leader of thermal process development and control products and winner of multiple industry awards, announces that MB (Marybeth) Allen will present a paper at the European and International Electronics Assembly Reliability Summit in Tallinn, Estonia from October 22-24, 2008. The event will be held at the Tallink Spa & Conference Hotel over two days and will be preceded by training workshops from top trainers in their field.

KIC's specialist, MB Allen, will present a paper that focuses on 'Reflow Significance on Package on Package (PoP)' on Friday, October 24 at 9:30 a.m. in Room 2. A design of experiment will be set up to understand the implications of various reflow parameters on the final PoP yield.

More than two years after the RoHS directive first came into force, the technical conference has been set up at a critical time for the electronics industry. With new assembly methods and materials raising reliability issues, the event will provide a unique opportunity to tackle this critical topic through industry discussion, technical collaboration and information sharing.

For more information about KIC, visit http://www.kicthermal.com.

Based in San Diego, KIC is the industry leader in automated thermal management tools and systems for reflow, wave, cure and semiconductor thermal processes. The company pioneered the development of oven profilers and process development tools, and then worked to create the next generation of thermal systems to help manufacturers optimize and monitor thermal processes. In addition to SlimKIC 2000-LF, products include standard SlimKIC 2000, the KIC 24/7 continuous monitoring system and more. With the introduction of cutting edge tools, the company continues to stay on the leading edge of process optimization and real time thermal management systems, and has won numerous industry awards.

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