SMT, PCB Electronics Industry News

SMT, PCB Electronics Industry News

News from ESSEMTEC


Essemtec to Exhibit at Mexitronica 2008

Oct 07, 2008

ESSEMTEC, the leading manufacturer in Mexico of surface mount technology production equipment for mid volumes, announces that it will showcase several SMT production systems at the upcoming Mexitronica exhibition, scheduled to take place October 21-23, 2008, at the Expo Guadalajara, Hotel Hilton, in Guadalajara, Jalisco, M�xico.

The following systems will be on display during the show:

SP003MLV � A semi-automatic stencil printer with vision for faster control and alignment correction, the system features new trans-stencil vision and offers users reliable and precise printing, a motorized print head, and vertical stencil separation. Additionally, the low-maintenance printer can accommodate stencils or screens up to 23 x 23". SP003-MLV achieves precise printing by controlling all important print parameters including squeegee pressure, angle of squeegee, print speed, stencil position and stencil separation after printing. With the new trans-stencil vision, print alignment is even easier to control.

Pantera-XV � A multi-flexible SMD placement system, this machine directly addresses prototyping and production runs in mid-sized quantities. The PANTERA-XV provides high placement accuracy and speed, a broad application range, high reliability and very low maintenance costs, as well as very short changeover times and excellent cost-performance ratio. The PANTERA�XV placement machine handles the entire SMD range from 0201s to 50 x 50 mm QFPs with a fine pitch of 0.4 mm. Designed for the assembly of complex printed boards and fast changeover, the machine offers a large number of feeder slots (up to 108) in a small footprint of less than 1 square meter.

Expert-SAFP with UP3100 � A universal prototyping station with integrated vision and placement, the semi-automatic pick-and-place system can accurately and quickly mount small batches and prototypes of assembled SMD boards. The pick-and-place head is air suspended, and moves gently and ergonomically, allowing fast and accurate work. The placement system is perfectly suited for prototyping because it allows components to be picked from both reels and sticks, and from rest tape strips as well as loose components. A turning station for upside down components is standard on the system.

RO300FC-C � A full convection reflow oven with RO-CONTROL software, the system allows fast and homogenous heating, as well as high-temperature soldering of sensitive electronics. The integrated convection technology offers a unique and innovative and efficient way of heating � with a vertical hot air stream that evenly heats the complete PCB. Both standard and lead-free pastes can be used. As an innovative new feature, RO300FC-C now features RO-CONTROL software for increased process simulation and control. RO-CONTROL combines all the important functions for the process evaluation and process control for reflow ovens. This technologically advanced software offers many of the same features as thermal profilers, but for less than half the price.

For more information on the above systems, visit Essemtec at Mexitr�nica or contact Ron Torenko, president, Torenko & Associates at 972-226-9611 or ron@torenko.com

About the company:

Essemtec is a worldwide leader in the manufacturer of Surface Mount Technology (SMT) production equipment. Essemtec specializes in high mix production equipment for Printed Circuit Boards (PCB) using Surface Mount Technology.

Essemtec is the only manufacturer to cover the entire production process, from Printers and/or Dispensers, to Pick-and-Place and Soldering equipment. Therefore, customers benefit from unparallel knowledge and the ability to select, from a single source, a complete process solution to meet their requirements.

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