AQUANOX� A4241 is an aqueous cleaning solution designed with a revolutionary inhibition technology to be effective on the toughest soils while protecting even the most sensitive parts from etch or darkening. Kyzen introduces a product that can be used in a multi-process environment for use in spray batch, spray in-line and stencil cleaning processes. A4241 will provide brilliant solder joints with no sump side additives and consistent cleaning results with minimal bath monitoring. AQUANOX� A4241 is multi-metal safe including bare aluminum and copper.
A non-flammable, non-corrosive liquid, AQUANOX� A4241 has been proven to be compatible with all materials commonly used in electronics assembly manufacturing and cleaning processes. AQUANOX� A4241 is a non-hazardous, biodegradable aqueous solution that contains no CFCs or HAPs.
The Kyzen Applications Laboratory has evaluated AQUANOX� A4241 for effective removal of nearly 300 soldering materials from the world's leading suppliers including, Senju, Alpha, Kester, Indium, Aim, Koki, Nihon Superior, Balver Zinn GmbH & Co. KG, Amtech, Cobar, EFD, Florida Cirtech, Formosa, Heraeus, Interflux, Metallic Resource, Multicore, Promosol, Qualitek and Shenmao.
Also, during the conference session of Cemconex, Serge Tuerlings, Kyzen's European Technical Manager, will present �Innovative Engineered Cleaning Fluid Designed to Remove Process Soils from Stencils, SMT, and Rework in Batch and Inline Cleaning Equipment.� The paper is authored by Kyzen's Mike Bixenman, Fernando Rueda and Serge Tuerlings.