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Kester to Participate in 2008 IMPACT/EMAP Conference

Oct 07, 2008

ITASCA, IL � October 2008 � Kester announces that it will present during the 3rd International Microsystems, Packaging, Assembly and Circuits Technology (IMPACT) Conference and the 10th International Conference on Electronics Materials and Packaging (EMAP), which will be held as a joint conference in conjunction with the TPCA Show at the Taipei Nangang Exhibition Center from October 22-24, 2008.

Kester's presentation, �Halogen free debate on solder paste: IPC classification and application,� will be given by James Wang of Kester Taiwan on October 23. The paper will focus on the current IPC J-STD-004A standard and the impact of halogen free requirements on this classification. The solderability of halogen free solder paste formulas vs. halogenated formulas also will be examined.

For more information about the IMPACT/EMAP Conference, visit http://www.impact-emap.org

For more information on the presentation or Kester's full line of products and services, contact Kester by phone at (+1) 847-297-1600 or 800-2-KESTER (53-7837), by fax at (+1) 847- 699-5548, or by e-mail at customerservice@kester.com. Kester's Web site may be found at http://www.kester.com.

Founded in 1899, Kester is a world-renowned supplier of solder and related materials and services to the electronics assembly, micro-component, and industrial soldering markets. Kester is known for high quality, advanced technology and superior technical support. With headquarters in Itasca, IL, Kester has additional manufacturing facilities in the United States, Mexico, Canada, Singapore, Germany, Japan, Brazil, Taiwan, Malaysia and China. Its worldwide manufacturing and technical capabilities provide the support required to serve major electronics manufacturing services providers and OEMs.

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