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IPC/SMTA High-Performance Electronics Assembly Cleaning Symposium Announces Session Three Speakers

Sep 21, 2008

ROSEMONT, IL � Industry-leading associations IPC and SMTA jointly announce that Joe Russeau (Session Chair) of Precision Analytical Laboratory, Dr. Bev Christian of Research in Motion, Dave Hillman of Rockwell Collins, Matt Kehoe of Sipad Systems, and Doug Schueller of AbleConn will present during Session 3 on Building to Customer Reliability Standards in Class 2 and Class 3. The symposium, jointly sponsored by IPC and SMTA, will be held at Crowne Plaza Chicago O'Hare in Rosemont, IL on October 28-29, 2008.

The successful implementation of low residue (i.e., no-clean) flux/solder paste creates a common misconception that electronics assembly cleaning has become a concern of the past. Those who truly understand the nature and the demands of today's technologies do not generally subscribe to this fallacy. The reality is that the overall need for cleaning has not diminished. Cleaning needs either have shifted or remained where they were, and, in addition, new needs have developed. For example, those who are knowledgeable about low residue assembly teach that a no-clean process does not mean �no cleaning.� Cleaning plays a key role in the successful implementation of a no-clean process.

Dr. Bev Christian will discuss component cleanliness when building to a no-clean standard. Dave Hillman will discuss reduced cleaning using the science of leaving residues alone. Matt Kehoe will discuss simplifying the no-clean assembly process using solid solder deposits. Doug Schueller will discuss cleaning process developments in a high-mix, medium-volume Class 3 manufacturing environment.

For more information about the conference, visit http://www.ipc.org/CleaningConferenceBrochure. Visit http://www.ipc.org/CleaningConfSponsorshipApp for information about the sponsorship application, and http://www.ipc.org/CleaningConfTabletopApp for the tabletop application.

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