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IPC/SMTA High-Performance Electronics Assembly Cleaning Symposium Announces Session Two Speakers

Sep 12, 2008

ROSEMONT, IL � Industry-leading associations IPC and SMTA jointly announce that Dr. Laura Turbini (Session Chair) of Research in Motion, Doug Pauls of Rockwell Collins, Joe Russeau of Precision Analytical Laboratory, Steven Perng of Cisco Systems, and Jack Fischer of Interconnect Technology Analysis will present in Session 2 on Cleanliness Assessment. The symposium, jointly sponsored by IPC and SMTA, will be held at Crowne Plaza Chicago O'Hare in Rosemont, IL on October 28-29, 2008.

To achieve the demand for higher functioning electronics assemblies, engineers must meet stringent reliability standards. Failure analysis is increasingly complex, placing needs for improved standards to detect reliability root cause problems. Doug Pauls of Rockwell Collins will discuss advances in test boards for qualifying the manufacturing process and reliability analysis. Joe Russeau of Precision Analytical Laboratory will discuss the methodologies used to evaluate cleanliness of printed wiring assemblies. Steven Perng of Cisco will discuss spot cleaning assessment under components following inline cleaning. Jack Fischer of Interconnect Technology Analysis will present the IPC Technology Roadmap Future of Interconnect Technology and its impact on cleaning for reliability.

For more information about the conference, visit http://www.ipc.org/CleaningConferenceBrochure. Visit http://www.ipc.org/CleaningConfSponsorshipApp for information about the sponsorship application, and http://www.ipc.org/CleaningConfTabletopApp for the tabletop application.

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