SMT, PCB Electronics Industry News

SN100CL Minimum Thickness Guidelines

Sep 10, 2008

SN100CL Minimum Thickness Guidelines

Currently, there are no set criteria for minimum lead free solder finish requirements. Many companies who have run this solder coating process in the tin-lead version know that thickness varies dramatically based on pad size. Furthermore, minimum coating thickness is more critical to the solderability of SN100CL more than it is to standard tin-lead finish. Combining these two facts, it is all the more important to create a new standard by pad area.

After studying literally thousands of panels and the subsequent solderability results, Saturn Electronics Corporation has established a coupon and general guidelines for this finish.

Having this coupon on the actual board / array removes the variation in acceptability measurements between the supplier and the customer by standardizing not only the location of the measurement, but also the thickness by applicable pad geometry.

Also, customers can request a gerber format of this coupon to the waste area of ther boards. Additionally, Saturn will send the suggested minimum thickness requirements resulting from the study.

Visit the SN100CL Minimum Thickness Guidelines page at: http://www.saturnelectronics.com/minimumguides.htm

If you have any further inquiries, contact Saturn Electronics Corp. to speak with an engineer regarding any further technical matters.

Mar 30, 2016 -

Saturn Electronics Corporation Supporting U of M Autonomy project

Oct 21, 2014 -

The University of Michigan Solar Car Team To Represent the Saturn Electronics at the 2014 SAE Convergence

Mar 18, 2013 -

Domestic PCB Fabricator Certifies Nine Employees as IPC Application Specialists Per IPC-A-600

Mar 16, 2011 -

Consult LED Thermal Management Expert

Nov 09, 2010 -

Via Plugging Guidelines

Sep 30, 2010 -

Yash Sutariya to Present at IPC Technology Interchange on Thermal Management: Getting the Heat Out

Sep 08, 2010 -

Via Hole Filling

Mar 05, 2010 -

New Material & Fabrication Process Improves LED PCB Thermal Conductivity

Dec 01, 2009 -

Thermal Management for LED Applications

Oct 27, 2009 -

LED MCPCBs

31 more news from Saturn Electronics Corporation »

Jun 18, 2018 -

About the creation of communication standards to enable machine to machine cooperation in SMT lines by ELS

Jun 18, 2018 -

Online SMT Auction July 5th – July 11th, 2018

Jun 17, 2018 -

SMT Nuremberg Pays Off for Europlacer & Speedprint.

Jun 17, 2018 -

Libra Industries’ Christopher R. Howell Memorial Foundation Awards $22,500 in Scholarships during Annual Golf Outing

Jun 17, 2018 -

New Low-Temperature Solder Paste from SHENMAO

Jun 17, 2018 -

Jeremy Zhou Appointed to China Regional Sales Manager for VJ Electronix, Inc.

Jun 17, 2018 -

IPC’s PCB Technology Trends Study Underway, OEM Survey Open Until July 6

Jun 17, 2018 -

Join Scienscope this Week at the SMTA Upper Midwest Expo

Jun 17, 2018 -

IPC Hand Soldering Regional Qualification Competition Winner Crowned at SMT Hybrid Packaging 2018

Jun 17, 2018 -

DDM Novastar Welcomes New Director of Engineering

See electronics manufacturing industry news »

SN100CL Minimum Thickness Guidelines news release has been viewed 2 times

x-ray inspection

Fluid Dispense Pump Integration