Process Cleaning Rate Theory holds that the static cleaning rate (chemical forces) plus the dynamic cleaning rate (mechanical forces) must be understood to deliver a clean part. The focus of this panel discussion is to provide users with an understanding of material options for formulating electronic cleaning fluids to address current and future cleaning needs. Attendees will gain an understanding of cleaning formulation design and the constraints formulators must consider to succeed within the manufacturing environment.
The topics will address variables that formulators take into consideration when designing cleaning materials. Issues such as solder flux residue differences, material compatibility constraints, throughput considerations, and process variables will be discussed. Variations in formulation design to support different machine types and agitation modes including constraints of wash time and cost of ownership likewise will be discussed.
For more information about the conference, visit http://www.ipc.org/CleaningConferenceBrochure. Visit http://www.ipc.org/CleaningConfSponsorshipApp for information about the sponsorship application, and http://www.ipc.org/CleaningConfTabletopApp for the tabletop application.