SMT, PCB Electronics Industry News

Scott Kenter Joins FINETECH as Applications Engineer

Sep 02, 2008

FINETECH announces that Scott Kentner has joined the Manchester, NH team as Applications Engineer.

In his new position, Scott will work closely with customers, focusing on new process development, application support, field service and training for the company's advanced rework and precise die-attach equipment.

Scott has numerous years of experience as a customer support engineer and product specialist in the electronics assembly industry. He will use his experience and expertise to help provide solutions to customers for their specific project challenges. Previous positions were held within the Besi Die Handling group.

FINETECH provides industry-leading machine specifications and process know-how built over years of customer application experience. The main US demo facility is located in Tempe, Ariz.

About FINETECH

FINETECH is a leading manufacturer of innovative micro assembly and rework equipment for the latest advanced packages. The modular design of the FINEPLACER� platform enables a multitude of applications, from reworking SMDs to the highly accurate placement of flip chips or opto-electronic components. FINETECH is headquartered in Berlin, Germany, with offices in Tempe, Arizona, Shanghai, China, and Kuala Lumpur, Malaysia.

Apr 07, 2016 -

Finetech/Martin Introducing New Rework and Dispense Solutions at IPC APEX 2016

Nov 27, 2013 -

Martin Streamlines and Simplifies Rework with New Process Shuttle

Nov 08, 2013 -

Finetech Unveils High Force ACF Bonder

May 28, 2013 -

Al Cabral Joins Finetech as Regional Sales Manager

Mar 11, 2013 -

Donated Finetech Die Bonder Installed at Pennsylvania State University

Jan 16, 2013 -

Finetech to Exhibit the Ideal Blend of Performance and Cost Rework Technology at the 2013 IPC APEX EXPO

Jan 04, 2013 -

Finetech to Exhibit Sub-micron Die Bonder at SPIE Photonics West

Oct 03, 2012 -

The Best in Rework Technology – Finetech to Exhibit FINEPLACER® Core Rework System at SMTA International

Sep 26, 2012 -

MARTIN to Demonstrate Mini-Oven Reball/PreBump Unit at the Mississauga EPTECH Electronics Show

Sep 10, 2012 -

MARTIN to Participate in Package on Package (PoP) Design and Assembly Center SMTA International 2012

76 more news from Finetech »

May 23, 2018 -

Koh Young, the 3D Inspection Market Leader, Reports Strong Quarterly Results Again

May 22, 2018 -

Metcal Is Reinventing Hand Soldering – Learn More at the SMTA Upper Midwest Expo

May 22, 2018 -

Europlacer to Show Full Assembly Line Products & Solutions at SMT Nuremberg.

May 22, 2018 -

IPC Releases Additional Test Coupons for the IPC-2221B Gerber Coupon Generator Test Coupons provide structural integrity verification based on current printed board design technology

May 22, 2018 -

Specialized Coating Services Hosts Successful Open House for New Billerica Facility

May 22, 2018 -

Koh Young Continues to Strengthen its Support Network for the Americas

May 21, 2018 -

Naprotek, Inc. Installs Flexible New MXI System

May 21, 2018 -

Ersa Holds National Sales Meeting with Hands on Training

May 21, 2018 -

New Lightweight Cartridge Applicators from Techcon

May 21, 2018 -

KIC to Discuss Closing the Loop at SMT/Hybrid/Packaging

See electronics manufacturing industry news »

Scott Kenter Joins FINETECH as Applications Engineer news release has been viewed 928 times

Rework Training Materials

IPC Training & Certification - Blackfox