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International Wafer-Level Packaging Conference Moving Toward Largest Program in Its History

Aug 14, 2008

San Jose, CA � This year's fifth annual International Wafer-Level Packaging Conference (IWLPC), October 13-16, will be the largest ever, according to Dr. Ken Gilleo, IWLPC general chair.

�Exhibitor and attendee interest has been very high, and we anticipate this year's event will be the largest, as well as the most comprehensive, in our history,� Dr. Gilleo said. With two months to go, the 60-table exhibitor space at our Wyndham Hotel venue is nearly fully occupied.

The first two conference days, October 13-14, are devoted to specialized professional workshops, conducted by well-known experts. The concluding days, October 15-16, will feature a keynote dinner, exhibits, special panels and 12 sessions covering key topics in wafer-level packaging, materials and processes.

At a special morning opening address on October 15, Dr. Stuart Parkin, a Fellow at IBM's Almaden Research Laboratory, San Jose, will discuss �racetrack memory.� Dr. Parkin, a specialist in �spintronics,� will reveal how racetrack memory may lead to solid-state electronics with no moving parts, capable of holding an unparalleled amount of data.

Following Dr. Parkin's talk, a special panel comprised of four leading industry foreers, will discuss the business of MEMS and semiconductor packaging. Speakers include Jan Vardaman, TechSearch; Jim Walker, Gartner Group; Dr. Eric Mounier, Yole D�veloppement; and Dr. Dan Tracy, SEMI.

The keynote dinner on October 15 will feature Dr. Thomas H. Di Stefano, a pioneer in chip-scale packaging and wafer-level packaging and testing technology. Dr. Di Stefano, a founder of Tessera, San Jose and now president and CEO of Centipede Systems, will discuss, �Wafer-Level Packaging: The Promise Evolves.�

On Thursday, October 16, the program will open with a special panel discussing, �Where in the World: The Rewards and Risks of Locating Offshore.� Experts on outsourcing electronics in four different countries: China, India, Mexico and Vietnam will detail the challenges and benefits of offshore locations.

On October 15-16, papers covering a wide variety of topics in the stacked packaging, chip-scale- and wafer-level packaging and testing areas will be presented throughout both days. For more information, visit http://www.iwlpc.com.

Sponsors for this year's IWLPC are Amkor Technology and Umicore Electronic Materials (platinum); Indium Corporation, Mintz Levin, Pac Tech USA, and Tessera Technologies (gold); Phoenix X-Ray (silver); John Wiley & Sons is the special book sponsor.

The SMTA membership is an international network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies, including microsystems, emerging technologies, and related business operations.

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