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IPC/SMTA High-Performance Electronics Assembly Cleaning Symposium Announce Day 2 Keynote Speaker

Aug 14, 2008

ROSEMONT, IL � Industry-leading associations IPC and SMTA announce that Linda Woody will keynote Day 2 of the jointly sponsored High-Performance Electronics Cleaning Symposium to be held at Crowne Plaza Chicago O'Hare in Rosemont, IL on October 28-29, 2008.

Linda Woody, 30-year veteran in electronics assembly and electro-optical design, will be the featured keynote speaker for Day 2. Linda is a member of the Lockheed Martin Missiles and Fire Control Technical Excellence Staff acting as subject matter expert in the field of electronics manufacturing and soldering technology.

Linda will be speaking on nozzle design and implementation for cleaning flux residues from high-density, low-profile component assemblies. Special considerations in designing a cleaning process to remove flux residues under �BGAs, leadless chip carriers, chip cap resistors, and fine-pitch components must be taken into account when ing the cleaning equipment to perform the task. Linda will present data showing the criticality of the nozzle delivery system. The presentation will describe the process and major elements of nozzle design to achieve the cleaning objective.

For more information about the conference, visit http://www.ipc.org/CleaningConferenceBrochure. Visit http://www.ipc.org/CleaningConfSponsorshipApp for information about the sponsorship application, and http://www.ipc.org/CleaningConfTabletopApp for the tabletop application.

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