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News from KYZEN Corporation

Kyzen's to Participate in Technical Sessions during SMTA International 2008

Aug 07, 2008

NASHVILLE � August 2008 � Kyzen, a world leading provider of environmentally responsible precision cleaning products for electronics and high-technology manufacturing operations, announces that it will both present and chair technical sessions during the 2008 SMTA International Conference and Exhibition, scheduled to take place August 18-20, 2008, at the Coronado Springs Resort in Orlando, FL.

Mike Bixenman, Kyzen's chief technology officer, and Steve Stach of Austin American Technology Corp. will present �Residues on Populated Circuit Assemblies.� The paper will be given during the �Cleaning Challenges in Today's Environment� session on Tuesday, August 19, 2008 from 1:30-3 p.m. in Coronado D. In this session, speakers will provide important information necessary to build a robust cleaning process.

The session will focus on challenges in the cleaning process. High-density assemblies, low standoff components such as leadless QFNs, new soldering fluxes and pastes, and the higher temperatures required by lead-free soldering all have made cleaning a major challenge for today's electronics. The residues under low profile components and from higher processing temperatures are very difficult to remove and can cause reliability problems. Improved cleaning chemistries and equipment are needed.

Also during the conference, Tom Forsythe, Kyzen's vice president, will chair the �Assembling with Discretes� session with co-chair Sang Liu, Ph.D., of Huawei Technologies Co., Ltd. on Tuesday, August 19, 2008 from 1:30-3 p.m. in Coronado A. This session will look at several aspects of discrete components as they relate to the increased temperature of lead-free processing. New findings associated with out-gassing of tantalum capacitors, tombstoning of small 0201 chip components, pad design and solder volume all will be discussed in this session. This review of discrete components consists of three papers dealing with this timely topic.

Dedicated to surface mount, advanced packaging and related technologies, SMTAI will focus on lead-free, SMT, process control, flip chip, chip scale, BGA, RoHS compliance, harsh environments and more. Additionally, the event will feature an encompassing technical conference organized by the SMTA with technical papers from global experts, tutorials, and special symposiums. For more information about the conference and exhibition, visit

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