SMT, PCB Electronics Industry News
  • SMTnet
  • »
  • Industry News
  • »
  • Latest VectorGuard� Technology from DEK Earns Advanced Packaging Award

Latest VectorGuard� Technology from DEK Earns Advanced Packaging Award

Jul 24, 2008

When DEK's revolutionary VectorGuard� stencil technology was introduced six years ago, the company pledged ongoing engineering investments to deliver foil designs to serve countless next-generation applications. Living up to this promise, DEK's latest advance, VectorGuard Platinum�, was introduced last week at Semicon West and its ingenuity earned a prized Advanced Packaging Award.

Pushing beyond the limits of conventional stencil technology, VectorGuard Platinum draws on micro-stencil, electroformed fabrication techniques to deliver stencils capable of addressing the challenges of advanced packaging applications that require unprecedented aperture and web spacing dimensions. Enabling extremely fine geometries and exceptionally high yields, VectorGuard Platinum technology successfully meets the demands of ball grid arrays (BGAs), direct chip attach, flip chip and wafer-level applications.

�VectorGuard not only offers the inherent flexibility and quick changeover afforded by the system's unique technology, but the Platinum capability now also enables this versatility at the uppermost range of advanced semiconductor packaging processes,� comments Karen Moore-Watts, Global Marcom Director at DEK. �We are delighted that the distinguished judging panel has recognized the process-enabling advances afforded by VectorGuard Platinum and have honored the technology with an Advanced Packaging Award.�

With a MEMS-based fabrication process as its core, the precision of VectorGuard Platinum enables apertures of 20 �m on 50 �m pitch, while also delivering outstanding thickness uniformity. The unique manufacturing process of the Platinum foils guarantees exceptionally smooth sidewalls for extremely efficient paste transfer, which is essential for high-yield, ultra fine pitch advanced packaging applications. Other characteristics and benefits of VectorGuard Platinum stencils include low internal stress and high hardness to eliminate stencil deformation, and superior control of surface roughness to ensure accuracy, uniformity, quality and tightly controlled deposits for both pastes and adhesives.

�Packaging specialists can now enjoy the VectorGuard advantages of quick product changeover, unmatched tension control, simplified storage and ease-of-use while pushing materials deposition accuracy, repeatability and uniformity to new levels,� concludes Moore-Watts. �We sincerely thank the organizers of the Advanced Packaging Awards for rewarding VectorGuard Platinum's superior performance.�

For more information on DEK's VectorGuard Platinum technology or any of the company's advanced materials deposition solutions, log onto http://www.dek.com.

About DEK

DEK is a global provider of advanced materials deposition technologies and support solutions including printing equipment platforms, stencils, precision screens and mass imaging processes used across a wide range of applications in electronics pre-placement subassembly, semiconductor wafer manufacture, and native energy component production. For more information, visit DEK at http://www.dek.com

Feb 28, 2014 -

Experience Unmatched Printing Knowledge and Future Technology Capability with DEK at APEX 2014

Mar 21, 2012 -

DEK Earns its Tenth Consecutive Service Excellence Award; Customers Consistently Impressed with Support

Feb 15, 2012 -

ProDEK Closed Loop Printing Technology Raises the Bar on Dynamic Process Control

Feb 15, 2012 -

ProDEK Closed Loop Printing Technology Raises the Bar on Dynamic Process Control

Jan 20, 2012 -

DEK signs contract with Ortana at Productronica 2011

Dec 21, 2011 -

Indium Corporation snaps up DEK Horizon 01iX at Productronica 2011

Dec 02, 2011 -

DEK and Interlatin Take Productivity on Tour to Overwhelming Response

Aug 03, 2011 -

Great Lakes Engineering Licenses DEK VectorGuard® Technology

Jul 22, 2011 -

DEK partners with OKI to introduce breakthrough technologies at first Advanced SMT Processes and Applications Seminar in Chengdu

Jun 24, 2011 -

Vicor Sees Improvement with DEK’s Nano-ProTek Stencil Coating

131 more news from DEK International »

Jul 21, 2017 -

Epec Now Offering PCB Layout and Design Services

Jul 21, 2017 -

Help customer solve problems of 750L machine

Jul 19, 2017 -

Digicom Electronics Receives AS9100:2016 (RevD) Aerospace and ISO 9001:2015 Certifications

Jul 19, 2017 -

Conecsus Presents SMT Metals Waste Recycling Solutions at SMTAI 2017

Jul 19, 2017 -

New Metcal HTD Tips & Hand-piece Increase Throughput and Save Money

Jul 19, 2017 -

Altus Supports Bespoke Desktop Robots for Automated Soldering, from ATN Germany

Jul 19, 2017 -

STI Acquires Fischerscope X-ray XDAL 237

Jul 19, 2017 -

COT Reduces Prices on SMT Nozzles & Consumables

Jul 19, 2017 -

Cogiscan Partners with iBASEt for Automated Electronics Assembly

Jul 19, 2017 -

International Wafer-Level Packaging Conference (IWLPC) Program Announced and Registration Now Open

See electronics manufacturing industry news »

Latest VectorGuard� Technology from DEK Earns Advanced Packaging Award news release has been viewed 697 times

  • SMTnet
  • »
  • Industry News
  • »
  • Latest VectorGuard� Technology from DEK Earns Advanced Packaging Award
Capillary Underfill process

Used PCBA Equipment