The CX-1 is an innovative advanced placement system that is capable of placing advanced packages and features high-accuracy applications as well as standard SMT. The CX-1 is capable of placing SiP, MCM and other mixed-technology applications. This flexibility ensures users of high-quality placements and contributes positively to its lines. Also, the CX-1 is built on the base of a standard SMT machine, but with highly accurate glass linear encoders. Special software periodically checks and calibrates to ensure ultra-high accuracy.
With traditional lines, four machines are necessary; however, with the CX-1, only three systems are used to accomplish the same production levels. This technologically advanced capability also leads to key savings in time and reduced number of operators. The CX-1 addresses the industry challenge of increasing use of bare die and flip chips mixed with standard SMT (such as cell phones, PDAs, etc.).
With the highest placement accuracy and lowest cost of ownership, the placement machine offers fast throughput for SMT (exceeding typical speed/throughput of competitive placement systems). Additionally, the CX-1 is compatible with existing feeders and line control software (HLC). The system is based on proven technologies and is more economical than dedicated machines. In regard to cost effectiveness, the system is significantly cheaper than die-attach machines PLUS it can place standard SMT at mid-volume levels. The CX-1 is much less expensive than buying two machines, and also uses less floor space and requires less training (one machine to learn vs. two). The CX-1 contributes high-quality placements to a line. The system features HMS II to measure board surface height and flatness and placement flatness and the placement force control.
The CX-1 comes standard with four placement heads. These heads are capable of laser/vision centering, independent X and theta motors, and can handle boards up to 330 x 250 mm and feature a standard 27 mm FOV high-resolution camera.
The system itself offers two modes � high accuracy and standard accuracy. The high-accuracy mode features speeds of 1,300 (vision) and 1,600 (laser), and an accuracy of �20 mm. The standard accuracy mode features a speed of 11,000 cph and an accuracy of �40 mm.
Sponsored by Solid State Technology Magazine, in cooperation with Advanced Packaging Magazine, the Attendee's Choice Awards is now in its sixth year. SEMICON West attendees vote on products seen on the trade show floor. There are two separate competitions: one for �Wafer Processing� products and one for �Final Manufacturing� products.
Juki Corporation's experience as the market leader in industrial sewing machines was the stepping-stone for the entry into the printed circuit board assembly market in 1987. Since then, Juki has delivered more than 20,000 automated assembly systems worldwide and is currently shipping an average of 200+ assembly machines per month. This extraordinary achievement makes Juki one of the world's leading providers of automated assembly products and systems. In addition to its core technologies, Juki's Electronic Assembly and Test Systems Division develops and manufactures advanced electronic systems and computer software for data entry, mail processing and other electronic equipment.
With the purchase of Zevatech's ass in November 1999, Juki Automation Systems now brings Juki's reputation for top quality and reliable service also to the North and South American and the European electronics assembly markets. Juki recognizes the challenges of the new century and is prepared to respond to the globalization of electronic manufacturing. With a sophisticated knowledge base, advanced technologies and a high commitment to its customers, Juki is poised for continued growth in the 21st century.