Fully configured, the MV-7L provides one top-down camera with a native resolution of four mega pixels (2,048 x 2,048) and four side-view cameras with a native resolution of two mega pixels (1,600 x 1,200). The patented �Quad Angle Lighting System� on the system provides four independently programmable zones for optimal illumination of inspection areas.
A three-stage conveyor system with automatic board support and PCB clamping mechanism is designed for maximum throughput of the line. Precision motion control systems provide absolute reproducibility and repeatability. Additionally, a powerful OCR engine provides advanced part marking inspection. The MV-7L features ultra-high-speed PCB inspection � up to 4,940 mm2/sec (7.657 in2/sec).
The revolutionary Intelli-Scan Laser System provides �The Third Dimension in Inspection Capability� � the ability to precisely measure the Z-height of a given region of interest. This advanced technology provides: superior lifted lead detection for gull wing devices, four-point height measurement capability for coplanarity testing of BGA and CSP devices, and enhanced solder paste measurement capability.
The optional Side Viewer� Camera System provides four additional Two Mega Pixel Side View Digital Color Cameras for enhanced detection of lifted leads and lifted components. This system also provides solder joint inspection of J-leaded and LCC devices.
Now in its eighth year, the Advanced Packaging Awards program is an annual celebration of product excellence in semiconductor packaging. Premier products based on the finest examples of creative advancement in technology in 21 key areas are chosen by a distinguished panel of industry experts.
MIRTEC is a leading global supplier of Multi-Camera Desktop and In-Line AOI systems to the Electronics Manufacturing Industry. For more information please contact MIRTEC directly. Phone: 203-881-5559 � Fax: 203-881-3322 � Web: http://www.mirtecusa.com.