SMT, PCB Electronics Industry News

Kyzen�s AQUANOX A4241 Wins Two 2008 Advanced Packaging Awards

Jul 19, 2008

NASHVILLE � July 16, 2008 � Kyzen, a world leading provider of environmentally responsible precision cleaning products for the electronics and high-technology manufacturing operations, announces that its AQUANOX� A4241 PCB and Stencil Cleaner won an Advanced Packaging Award in the category of Cleaning Chemistries and was named as a first finalist in the category of Flip Chip Equipment & Materials during the Advanced Packaging Award ceremony that took place on Wednesday, July 16, 2008 at the St. Regis Hotel Conservatory during the SEMICON West exhibition in San Francisco.

AQUANOX� A4241 is a new aqueous cleaning solution designed with a revolutionary inhibition technology to be effective on the toughest soils while protecting even the most sensitive parts from etch or darkening. Kyzen introduces a product that can be used in a multi-process environment for use in spray batch, spray in-line and stencil cleaning processes. A4241 will provide brilliant solder joints with no sump side additives and consistent cleaning results with minimal bath monitoring. AQUANOX� A4241 is multi-metal safe including bare aluminum and copper.

A non-flammable, non-corrosive liquid, AQUANOX� A4241 has proven compatible with all materials commonly used in electronics assembly manufacturing and cleaning processes. AQUANOX� A4241 is a non-hazardous, biodegradable aqueous solution that contains no CFCs or HAPs.

The Kyzen Applications Laboratory has evaluated AQUANOX� A4241 for effective removal of nearly 300 soldering materials from the world�s leading suppliers including, Senju, Alpha, Kester, Indium, Aim, Koki, Nihon Superior, Balver Zinn GmbH & Co. KG, Amtech, Cobar, EFD, Florida Cirtech, Formosa, Heraeus, Interflux, Metallic Resource, Multicore, Promosol, Qualitek and Shenmao.

AQUANOX A4241 is available in one, five and 55 gallon containers.

Now in its eighth year, the Advanced Packaging Awards program is an annual celebration of product excellence in semiconductor packaging. Premier products based on the finest examples of creative advancement in technology in 21 key areas are chosen by a distinguished panel of industry experts.

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