SMT, PCB Electronics Industry News
  • SMTnet
  • »
  • Industry News
  • »
  • Henkel and Leading Shanghai-Region Academia form Joint Electronics Research and Failure Analysis Center

Henkel and Leading Shanghai-Region Academia form Joint Electronics Research and Failure Analysis Center

Jul 01, 2008

Committed to promoting electronics material advancement in the burgeoning China region, Henkel and Shanghai University, in conjunction with several leading research universities, have entered into an agreement to form a Shanghai Region Joint Electronics Research and Failure Analysis Center. The official signing ceremony marking the commencement of the partnership took place on June 10, 2008 at Henkel Asia-Pacific and China Headquarters in Shanghai, China.

�Much of Henkel�s growth and that of the advanced electronics industry is, indeed, due to strategic partnerships with educational institutions,� commented Dr. Horst Eierdanz, Corporate Vice President, Henkel R&D Engineering Adhesives, in his opening address at the agreement signing. �One-third of Henkel�s Shanghai-based 150-person research and engineering team is dedicated solely to technology development activities and over 3% of our research and development expenditure is earmarked for cooperative efforts with universities and technology institutions. We are very excited about the broad scope of this latest endeavor with this highly regarded group of universities.�

Under the project management and executive committee leadership of Dr. Michael Todd, Henkel Vice-President of Product Development and Engineering, Dr. Tim Chen, Henkel Electronics General Manager of China and Hong Kong, Dr. Tom Lim, Director of Shanghai R&D Center of Henkel Corporate Research, and Professor Johan Liu, Shanghai University, China and Chalmers University of Technology, Sweden as well as the on-site supervision of Dr. Xinyu Du, R&D Manager of Henkel Huawei and Dr. Daniel Lu, Henkel Senior Technical Manager of Product Development and Engineering, the roadmap of the three-year project includes five key areas of research to be carried out at various universities. The fields of study include:

  • Study of the interfacial bonding mechanisms between metals and organic polymers

  • New latent curing systems for advanced electronics polymer applications

  • Fundamental studies of the rheological behavior of microelectronic assembly materials

  • Nanocomposite microelectronic packaging materials

  • Advanced microelectronic thermal solutions

�Henkel�s significant investment in this project is further proof of our commitment to advance technology, expand the success of this region and promote cost-effective, anticipatory materials solutions to the global electronics industry,� says Henkel�s Dr. Michael Todd.

�Indeed, the sizeable resource Henkel has budgeted for this project and the universities� investments of equipment, time and talent will certainly yield materials solutions that will benefit the entire electronics marketplace,� concurs Dr. Tim Chen.

The duration of the Shanghai Region Joint Electronics Research and Failure Analysis Center project is currently scheduled from April 1, 2008 through March 31, 2011. For more information on this or other Henkel materials research initiatives, call +86 21 28918000 or log onto the company�s website at

About Henkel

For more than 130 years, Henkel has been a leader with brands and technologies that make people's lives easier, better, and more beautiful. Henkel operates in three business areas -- Home Care, Personal Care, and Adhesives Technologies -- and ranks among the Fortune Global 500 companies. In fiscal 2007, Henkel generated sales of $19.218 billion and operating profit of $1.975 billion. Our 53,000 employees worldwide are dedicated to fulfilling our corporate claim, "A Brand like a Friend," and ensuring that people in more than 125 countries can trust in brands and technologies from Henkel.

Mar 16, 2018 -

Henkel Develops Non-Proprietary Solder Paste Analysis Toolkit for Modern Process Complexities

Jan 31, 2018 -

Henkel to debut new materials, share expertise at IPC APEX Expo 2018

Mar 06, 2017 -

TECHNOMELT AS 8998 Masking Material Producing Measurable Gains in Efficiency, Cost Control; Recognized with Industry Award

Mar 01, 2017 -

Steven Abramovich Appointed Head of Sales, Americas for Henkel’s Electronics Business

Feb 23, 2017 -

Water Soluble, Tin-Lead Solder Paste from Henkel Enables High-Yield Results for Demanding Applications

Jan 24, 2017 -

Henkel to Showcase Broad Range of Enabling Electronic Materials at IPC APEX Expo 2017

Sep 21, 2016 -

Broad Portfolio of Henkel Enabling Technologies on Show at SMTA International 2016

May 11, 2016 -

Henkel Honors Manufacturing Representative, E-Tronix, with its Fifth North American Representative of the Year Award

May 09, 2016 -

Henkel Partners with Tekra to Expand Coverage of its Electronic Inks Business in North America

Mar 30, 2016 -

Henkel Develops Thermally Conductive Technomelt® Solution

50 more news from Henkel Electronic Materials »

Jun 18, 2018 -

About the creation of communication standards to enable machine to machine cooperation in SMT lines by ELS

Jun 18, 2018 -

Online SMT Auction July 5th – July 11th, 2018

Jun 17, 2018 -

SMT Nuremberg Pays Off for Europlacer & Speedprint.

Jun 17, 2018 -

Libra Industries’ Christopher R. Howell Memorial Foundation Awards $22,500 in Scholarships during Annual Golf Outing

Jun 17, 2018 -

New Low-Temperature Solder Paste from SHENMAO

Jun 17, 2018 -

Jeremy Zhou Appointed to China Regional Sales Manager for VJ Electronix, Inc.

Jun 17, 2018 -

IPC’s PCB Technology Trends Study Underway, OEM Survey Open Until July 6

Jun 17, 2018 -

Join Scienscope this Week at the SMTA Upper Midwest Expo

Jun 17, 2018 -

IPC Hand Soldering Regional Qualification Competition Winner Crowned at SMT Hybrid Packaging 2018

Jun 17, 2018 -

DDM Novastar Welcomes New Director of Engineering

See electronics manufacturing industry news »

Henkel and Leading Shanghai-Region Academia form Joint Electronics Research and Failure Analysis Center news release has been viewed 1 times

  • SMTnet
  • »
  • Industry News
  • »
  • Henkel and Leading Shanghai-Region Academia form Joint Electronics Research and Failure Analysis Center
Manufacturing Software

KIC SPS Smart SMT Reflow Oven Profiler