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Mentor Graphics Publishes New Technology Book On BGA Routing by Charles Pfeil

Jun 26, 2008

WILSONVILLE, Ore., June 26, 2008 � Mentor Graphics Corporation (Nasdaq: MENT) today announced the publication of a new book written by Charles Pfeil, engineering director of Mentor�s Systems Design Division, entitled BGA Breakouts and Routing, Effective Design Methods for Very Large BGA. This publication, rich in technological expertise, explores the impact of dense ball-grid array (BGA) packages with high pin-count on PCB (printed circuit board) design, and provides solutions for inherent design challenges.

�Using a BGA is the most common method today for packaging a high pin-count or very dense application specific integrated circuits (ASIC) and field programmable gate arrays (FPGA). BGAs have been proved to be a reliable, cost-effective package while at the same time providing flexibility to address miniaturization and functional requirements,� said author Charles Pfeil. �However, as BGA density and pin count continue to increase, the designer�s ability to effectively design with the devices has not kept pace. Fortunately, significant advancements in PCB fabrication technology have enabled further miniaturization in the manufacturing process.�

These improvements, along with new software and design methods specifically for BGAs provide a means to successfully design using these devices.

�BGA Breakouts and Routing is a useful industry resource," said James Patten, assistant department manager, Components Design and Analysis Department, Northrop Grumman Space Technology. "The book explores BGA routing in a logical and straight-forward manner, and provides an orderly methodology while offering valuable insight into designing with these devices."

�We are proud to offer this in-depth look at the future enhancements of BGA technology,� said Dan Boncella, director of marketing, System Design Division, Mentor Graphics Corporation. �We continue to research and develop products for our customers with cutting-edge technologies providing designers with the tools necessary to enhance productivity and bring to market cost-effectively.�

To obtain a copy of BGA Breakouts and Routing, or to learn more about upcoming discussions, events and articles about BGAs and Mentor�s solutions to automating the design process for these complex, leading edge packages, visit, or contact Charles directly at .

About Charles Pfeil

Charles is an engineering director at Mentor Graphics, System Design Division and was the original product architect for the Expedition� PCB software and one of the inventors of XtremePCB and XtremeAR software tools. Charles has worked in the PCB industry for over 40 years as a designer, owner of a service bureau, and has worked in marketing and/or engineering management with prominent leaders in the EDA companies. In addition, Charles is a consistent contributing author to industry publications discussing trends and technologies in PCB design as well as a regular participant in industry workshops and seminars.

About Mentor Graphics

Mentor Graphics Corporation (NASDAQ: MENT) is a world leader in electronic hardware and software design solutions, providing products, consulting services and award-winning support for the world�s most successful electronics and semiconductor companies. Established in 1981, the company reported revenues over the last 12 months of over $850 million and employs approximately 4,200 people worldwide. Corporate headquarters are located at 8005 S.W. Boeckman Road, Wilsonville, Oregon 97070-7777. World Wide Web site:

Mentor Graphics and Expedition are registered trademarks of Mentor Graphics Corporation. All other company or product names are the registered trademarks or trademarks of their respective owners.)

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