SMT, PCB Electronics Industry News

SMT, PCB Electronics Industry News

News from i3 Electronics


Congressman Arcuri Visits Endicott Interconnect Technologies, Inc.

Jun 19, 2008

ENDICOTT, N.Y.� Congressman Michael Arcuri, representing New York�s people of the 24th district, visited Endicott Interconnect Technologies, Inc. (EI) on Thursday, May 29th, 2008. Also attending was Binghamton University President Lois DeFleur, who along with James McNamara, President and CEO of EI, highlighted the growing high-tech economy in the Southern Tier Region.

James McNamara discussed EI, emphasizing the Company�s growth since its inception and outlined measures taken to remain competitive in business segments that are continually moving offshore. Lois DeFleur then guided a tour of the Center for Advanced Microelectronics Manufacturing (CAMM) located at the EI facility.

A collaborative effort by Binghamton University, Endicott Interconnect Technologies and Cornell University, with funding from the United States Display Consortium (USDC), the CAMM will pioneer microelectronics manufacturing research and development in a roll-to-roll (R2R) format. These efforts will result in flexible, rugged, lightweight electronic components and innovative products that will be critical to next-generation applications in areas such as military and homeland security, lighting, energy and power generation, displays, and product identification and tracking.

�R&D is our engine for the creation of new products and intellectual property as well as an important tool for solving today�s manufacturing issues. Industry and academia collaboration has resulted in a truly impressive CAMM facility that will be the backbone of tomorrow�s electronics and helps to support our long range technology efforts,� commented James McNamara.

About Endicott Interconnect Technologies

Endicott Interconnect Technologies, Inc., with headquarters in Endicott, NY, is a supplier of electronic interconnect solutions consisting of fabrication and assembly of complex printed circuit boards, advanced flip chip and wire bond semiconductor packaging as well as precision equipment manufacturing and integration. EI product lines meet the needs of markets including defense and aerospace, communications and computing, semiconductor, advanced test equipment and medical, where highly reliable products built in robust manufacturing operations are critical for success. With more than 40 years experience in providing microelectronics solutions, the company brings to market a unique mix of leading edge technology and technical know how that provide customers with a time-to-market advantage and competitive differentiation. For more information about EI and its products, please visit http://www.endicottinterconnect.com.

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