SMT, PCB Electronics Industry News

SMT, PCB Electronics Industry News

News from FCT ASSEMBLY, INC.


FINE LINE STENCIL Introduces New Laser Technology

Jun 03, 2008

COLORADO SPRINGS, CO � June 3, 2008 � FINE LINE STENCIL, a division of FCT Assembly and a leading manufacturer of stencil products, announces the availability of LPKF Laser Technology/SMT Stencil Laser Technology.

Laser cut stencils deliver improved aperture definition and superior dimensional tolerances for finer pitch apertures, down to 0.4 mm (0.016"). Laser cutting is an accurate, repeatable process. On a 600 x 600 mm area, it is possible to cut features with an aperture of �9 �m and a positional tolerance of �12.5 �m. FINE LINE STENCIL is able to guarantee its customers the highest possible quality and precision. There are multiple parameters that dictate the quality of a high-performance stencil. The company invests the time and offers value in optimizing the cutting precision of its lasers that guarantee results.

FINE LINE laser cut stencils have become the standard for quality. LPKF has emerged as the leading supplier of stencil laser systems. FINE LINE has invested exclusively in LPKF lasers. The reliability, accuracy and quality combine to make its lasers the most superior systems in manufacturing SMT Stencils. The company has set new industry standards when it comes to technology and ultra high precision.

The beam on FINE LINE STENCIL�S laser deflection allows the cutting of circular pads with a diameter of 30 to 800 �m that can be produced with a roundness of almost 100 percent. Additionally, the cutting of any sharp contoured pad geometries with maximum precision is possible.

The LPKF MultiCut is the latest development among LPKF stencil laser systems. It is designed to supply the best possible metal stencil cutting quality and performance, focusing on dense patterns, tight tolerances and low surface area ratios.

Thin stencils with very dense aperture patterns often show warping (or coining) when cut with standard laser cutting systems. This warping is caused by the heat-affected zone around the laser beam relieving stress in the stencil material. This effect is more severe as the percentage of the material between apertures becomes less; in other words, thin and very dense stencils. The MultiCut uses the new laser technology that is eliminating the part of the laser pulse that is below the cutting energy, resulting in a reduced heat affected zone and perfectly flat stencils. The improved laser source also results in a smaller beam diameter, allowing minimum apertures of 40 �m (1.5 mil) diameter.

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