Sponsored by the SMTA, the Symposium focuses on the critical business markets and technologies of microelectronic packaging, interconnection, microsystems, nanotechnology, and assembly. The Program Committee is seeking participants to present recent research results on any of the following topics:
- Microsystems and Nanosystems Technology
- Solar Electronics
Abstracts of 500 words should be submitted by July 31, 2008, with title and author contact information. For on-line submissions, visit the Call for Papers page of the Pan Pacific event web site at: http://www.smta.org/panpac/call_for_papers.cfm
Abstracts may also be submitted to SMTA administrator JoAnn Stromberg by email: email@example.com. Abstracts should describe results from experiments and new techniques that focus on technical or economic data.
The SMTA membership is an international network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies, including microsystems, emerging technologies, and related business operations.