SMT, PCB Electronics Industry News
  • SMTnet
  • »
  • Industry News
  • »
  • Essemtec Announces Ability to Dispense Material and Place LEDs on Film Substrates

Essemtec Announces Ability to Dispense Material and Place LEDs on Film Substrates

May 18, 2008

Essemtec AG, a leading manufacturer of surface mount technology production equipment, announces that it can perform material dispensing and consecutive placement of LEDs on film substrates.

Ever more electronics manufacturers are required to economically dispense solder paste, isolating adhesives and placing LEDs on film substrates. Essemtec AG has developed a solution that can fulfill this growing need both efficiently and precisely.

Based on Essemtec`s proven placement machine FLX2010 MKL, a concept with a three-head system was designed. The head features a placement axis with an integrated component adjustment mechanism, as well as two independent axes with a piezo flow valve and a time-pressure dispenser gear. The dispensing valves are mounted on motorized, closed-loop driven precision linear axes to ensure an accurate movement in the Z-axis. The substrate is positioned on the machine table and is secured by vacuum. The spacious machine concept allows the handling of substrates in the format of 800 x 600 mm. The substrate is manually placed on the vacuum table and then adjusted to the positioning pins.

The vacuum is activated with a foot-operated switch, and the film substrate firmly sticks to the table. After the fiducials have been recognized by the vision system, the time-pressure dispenser applies three dots of isolating adhesive on the substrate � a larger one in the middle and two smaller dots aside. Then, solder paste dots are applied on the substrate solder pads using a high-precision, piezo-controlled PFV nozzle. The LEDs are then picked from Essemtec standard feeders, adjusted and accurately placed. The isolating adhesive, applied prior to the placement operation, eliminates any unwanted electrical contact between the solder dots.

The entire procedure at a glance consists of five steps:

  • Apply film substrate, adjust and activate vacuum by foot switch

  • Recognition of fiducials

  • Dispensing of dielectric adhesive, three dots per each LED

  • Placement of LEDs

  • Deactivate vacuum, take substrate from the table.

The system was designed using only Essemtec�s standard placement modules. These modules feature high reliability and durability, and more than 600 are installed worldwide. Custom-specific adaptations and applications are planned and realized quickly and in cooperation with the users.

Essemtec is a worldwide leader in the manufacturer of Surface Mount Technology (SMT) production equipment. Essemtec specializes in high mix production equipment for Printed Circuit Boards (PCB) using Surface Mount Technology.

Essemtec is the only manufacturer to cover the entire production process, from Printers and/or Dispensers, to Pick-and-Place and Soldering equipment. Therefore, customers benefit from unparallel knowledge and the ability to select, from a single source, a complete process solution to meet their requirements.

Feb 28, 2018 -

Essemtec Wins NPI Award for Tarantula All Terrain Jet Dispenser

Jan 24, 2018 -

Essemtec to Show All-in-One High Speed Assembly / Dispensing Platform at APEX

Oct 16, 2017 -

Puma/Tarantula - Essemtec‘s P&P/dispenser innovation at productronica

Aug 17, 2017 -

Essemtec to Show New All-in-One Jetting / Placement System at SMTAI

Jul 27, 2017 -

Essemtec to show all-in-one jetting/placement system at SMTA Capital Expo: the perfect NPI machine

Feb 21, 2017 -

Essemtec Wins the 2017 NPI Award for Multifunction Placement for the New FOX2

Jan 11, 2017 -

Essemtec Announces Placement & Jetting in a Single Pass Through with the New FOX2

Nov 21, 2016 -

Juerg Schuepbach Joins Essemtec as International Sales Manager

Oct 13, 2016 -

Essemtec's FOX Offers Hassle-Free Manufacturing of 2.5D Assemblies - Learn More at the Upcoming SMTA Expos

Sep 12, 2016 -

Essemtec Will Demonstrate the Spider Jet Dispenser at IMAPS 2016 in Pasadena

189 more news from ESSEMTEC »

May 20, 2018 -

BTU to Show PYRAMAX and Profile Guardian at SMT/Hybrid/Packaging

May 20, 2018 -

Viscom Presents Advanced Inspection Solutions for ‘Smart Factory’ at SMT Hybrid Packaging 2018

May 20, 2018 -

MIRTEC Europe to Exhibit at SMT/Hybrid/Packaging 2018

May 20, 2018 -

SHENMAO America to Participate in the eSMART Factory Conference

May 20, 2018 -

CyberOptics Presents Best-Practices for Reducing Reticle Haze in Semiconductor Scanners at the European Mask and Lithography Conference

May 20, 2018 -

Aegis Software and CalcuQuote Partner to Offer MES and RFQ Management Solution

May 20, 2018 -

Electrica Ltd. Purchases Mirtec’s MV-3 OMNI to Further Improve Quality Standard

May 20, 2018 -

Pickering Interfaces Releases Updated and Lite Versions of its Signal Routing, Software Switch Path Manager

May 18, 2018 -

YINCAE’S SMT 158A Receives High Praise

May 18, 2018 -

Solderstar to Exhibit at SMTA Michigan Expo & Tech Forum

See electronics manufacturing industry news »

Essemtec Announces Ability to Dispense Material and Place LEDs on Film Substrates news release has been viewed 973 times

  • SMTnet
  • »
  • Industry News
  • »
  • Essemtec Announces Ability to Dispense Material and Place LEDs on Film Substrates
Small Parts Tips

x-ray inspection system