SMT, PCB Electronics Industry News
  • SMTnet
  • »
  • Industry News
  • »
  • Breakthrough Epoxy Flux Technology from Henkel Offers Cost-Effective Single Material Solution for Advanced Package Configurations

Breakthrough Epoxy Flux Technology from Henkel Offers Cost-Effective Single Material Solution for Advanced Package Configurations

Apr 17, 2008

In what is truly a ground breaking material advance, Henkel Corporation has developed a new reflow cured encapsulant material that combines flux functionality and underfill protection into a single material. The breakthough product, Hysol� FF6000�, is a reflow curable material that is formulated to provide flux for lead-free solder joint formation and, when cured, delivers protection against mechanical stress.

Unlike traditional capillary underfill processes in which the device is mounted onto the printed circuit board, the assembly is reflowed and then the device is underfilled, Hysol FF6000 enables an in-line alternative that affords thorough device protection as well. With the epoxy flux process, bottom side spheres are dipped into Hysol FF6000 prior to component placement. The device is placed onto the printed circuit board or substrate and then travels through reflow. During the reflow process, the flux provides the action ncecessary for solder joint formation and the epoxy encapsulates each solder sphere, delivering added support and protection. This streamlined approach effectively eliminates the neeed for dispensing equipment and the time required for underfill application and cure.

Though relevant for a varity of applications, Hysol FF6000 is particularly well-suited for today�s Package-on-Package (PoP) device configurattions and/or very large BGAs and CSPs where tradional underfill processes may be problematic. Second-level device attachment in emerging PoP applications is particularly challenging. Currently, many PoP device assemblers use tacky flux material for top level component attachment, which enables solder joint formation but does not resolve the issues pertaining to device support and protection. However, when Hysol FF6000 is employed, both solder joint formation and sphere protection are achieved with a single material and in one, simple step. For very large BGA and CSP device applications, Hysol FF6000 also affords superior process efficiency. In these bigger devices � typically 23 x23 mm or more� large volumes of underfill must be dispensed in order to cover the entire device area. Not only is this costly from a materials point of view, but it is also time-consuming as underfill flow time on large devices can be lengthy. Hysol FF6000 offers an in-line alternative that saves both time and money.

�Without question, Hysol FF6000 has the potential to revolutionize the way the industry thinks about conventional flux and underfill processes,� says Henkel Global Product Manager, Robert Chu. �Enabling joint formation and sphere encapsulation with one material not only delivers tremendous throughput and cost-saving advantages, it may also provide more robust protection than other underfill alternatives. We believe this is a giant leap forward in materials technology � an advance that can completely alter current manufacturing techniques.�

For more information on Henkel�s Hysol FF6000 material, call the company�s headquarters at 949-789-2500 or log onto http://www.henkel.com/electronics.

About Henkel

For more than 130 years, Henkel has been a leader with brands and technologies that make people's lives easier, better, and more beautiful. Henkel operates in three business areas -- Home Care, Personal Care, and Adhesives Technologies -- and ranks among the Fortune Global 500 companies. In fiscal 2007, Henkel generated sales of $19.218 billion and operating profit of $1.975 billion. Our 53,000 employees worldwide are dedicated to fulfilling our corporate claim, "A Brand like a Friend," and ensuring that people in more than 125 countries can trust in brands and technologies from Henkel.

Mar 16, 2018 -

Henkel Develops Non-Proprietary Solder Paste Analysis Toolkit for Modern Process Complexities

Jan 31, 2018 -

Henkel to debut new materials, share expertise at IPC APEX Expo 2018

Mar 06, 2017 -

TECHNOMELT AS 8998 Masking Material Producing Measurable Gains in Efficiency, Cost Control; Recognized with Industry Award

Mar 01, 2017 -

Steven Abramovich Appointed Head of Sales, Americas for Henkel’s Electronics Business

Feb 23, 2017 -

Water Soluble, Tin-Lead Solder Paste from Henkel Enables High-Yield Results for Demanding Applications

Jan 24, 2017 -

Henkel to Showcase Broad Range of Enabling Electronic Materials at IPC APEX Expo 2017

Sep 21, 2016 -

Broad Portfolio of Henkel Enabling Technologies on Show at SMTA International 2016

May 11, 2016 -

Henkel Honors Manufacturing Representative, E-Tronix, with its Fifth North American Representative of the Year Award

May 09, 2016 -

Henkel Partners with Tekra to Expand Coverage of its Electronic Inks Business in North America

Mar 30, 2016 -

Henkel Develops Thermally Conductive Technomelt® Solution

50 more news from Henkel Electronic Materials »

May 25, 2018 -

Saelig Introduces LoRa/FSK Smart Modem Transceiver For Long Range Control

May 25, 2018 -

Allchips won 10 million of A Round Investment in January 2018

May 24, 2018 -

DOVER CORPORATION SELECTS OK INTERNATIONAL – CYPRESS AS AN INAUGURAL WINNER OF THE DOVER SAFETY EXCELLENCE AWARD

May 24, 2018 -

DOVER CORPORATION SELECTS OK INTERNATIONAL – CYPRESS AS AN INAUGURAL WINNER OF THE DOVER SAFETY EXCELLENCE AWARD

May 24, 2018 -

CyberOptics Demonstrates Advanced Airborne Particle Sensing Technology at SEMICON West

May 23, 2018 -

Koh Young, the 3D Inspection Market Leader, Reports Strong Quarterly Results Again

May 22, 2018 -

Metcal Is Reinventing Hand Soldering – Learn More at the SMTA Upper Midwest Expo

May 22, 2018 -

Europlacer to Show Full Assembly Line Products & Solutions at SMT Nuremberg.

May 22, 2018 -

IPC Releases Additional Test Coupons for the IPC-2221B Gerber Coupon Generator Test Coupons provide structural integrity verification based on current printed board design technology

May 22, 2018 -

Specialized Coating Services Hosts Successful Open House for New Billerica Facility

See electronics manufacturing industry news »

Breakthrough Epoxy Flux Technology from Henkel Offers Cost-Effective Single Material Solution for Advanced Package Configurations news release has been viewed 985 times

  • SMTnet
  • »
  • Industry News
  • »
  • Breakthrough Epoxy Flux Technology from Henkel Offers Cost-Effective Single Material Solution for Advanced Package Configurations
Fluid Dispense Pump Integration

KIC SPS Smart SMT Reflow Oven Profiler