SMT, PCB Electronics Industry News

SMT, PCB Electronics Industry News

News from Polyonics, Inc.

Polyonics Wins a 2008 EMAsia Innovation Award for the XF-546 Polyimide Label Stock

Apr 09, 2008

WESTMORELAND, N.H. � April 2008 � The leader in harsh environment label materials for product marking and industrial identification, Polyonics Inc., announces that it has been awarded a 2008 EMAsia Innovation Award in the category of Identification Systems for its XF-546 Thermal Transfer Printable White Polyimide Label Stock. The award was presented to the company during an April 9, 2008 ceremony that took place at The Foyer outside the Grand Ballroom of the Shanghai Everbright International Hotel during Nepcon China 2008.

Polyonics XF-546 is a polyimide label material with a permanent pressure silicone adhesive and a high opacity, medium gloss white topcoat specifically designed for thermal transfer printing. The printed polyimide label resists smearing, so no labels will have to be replaced or reprinted, speeding up the process.

The printed polyimide label resists smearing, even when the board and label are directly removed from a reflow or wave solder environment. When matched with the appropriate ink ribbon the labels are compatible with all of the leading cleaning chemistries on the market today so they can be cleaned right along with the board, saving time.

Each polyimide label produced has excellent resistance to harsh fluxes, cleaners, saponifiers, and wave solder environments, and resists all commonly used methods of cleaning Additionally, the labels can withstand process temperatures up to 1,000�F (538�C), depending on time exposure.

The labels are approved for lead-free applications, and have high PCS and barcode label first read rates.

Established in 2006, EM Asia Innovation Awards program strives to recognize and celebrate excellence in the Asian electronics industry, inspiring companies to achieve the highest standards and push the industry forward. For more information, please visit

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