SMT, PCB Electronics Industry News
  • SMTnet
  • »
  • Industry News
  • »
  • CyberOptics to Feature SE 300 Ultra� 3-D Solder Paste Inspection at Nepcon Shanghai 2008

CyberOptics to Feature SE 300 Ultra� 3-D Solder Paste Inspection at Nepcon Shanghai 2008

Apr 07, 2008

MINNEAPOLIS - December 20, 2007 - CyberOptics Corporation (Nasdaq: CYBE) announced that it will exhibit SE 300 Ultra, its industry-leading 100 percent 3-D solder paste inspection system, in the West Hall L1, booth 1A26 - at the upcoming NEPCON China/EMT China 2008 exhibition and conference - scheduled to take place April 8-11, 2008 in Shanghai, PR China.

This new generation in-line, 100 percent inspection system takes the SE 300 to the next level. SE 300 Ultra provides accurate, repeatable results at speeds that keep up with increasing line cycle times. The SE 300 Ultra incorporates the field-proven technology and reliable features of the SE 300 along with new features.

New features include programming time and inspection set up improvements, SPC charts in the Operator User Interface, an optional system sensor with an extended height range that can measure paste height up to 24 mils (610 �m), and a mechanical board stop solution.

Other recent additions include 1- and 2-D multiple bar codes read using the system sensor, an offline defect review workstation to allow users to easily review defects offline to maximize production throughput technology-leading 01005 pad inspection capabilities, enhanced warp compensation for flexible circuits, easy-to-use Operator Interface and Defect Review, and conveyor auto-width adjustment capability.

Offering ultra-fast inspection speeds, the system features a conveyor that accommodates panel sizes from 101 x 35 mm (4 x 1.4") to 508 x 508 mm (20 x 20"), flexible conveyor rail options � rear or front-fixed rail, program call-up using a bar code reader, and the ability to read skip marks and exclude data from inspection results.

Additionally, the SE 300 Ultra provides the ability to handle odd-shaped pads, superior paste height accuracy (each measurement calculated using 200k reference points) and an XML file format output for easy integration to shop floor control systems. The Ultra also features paste height, area and volume measurements with Gage R&R

About CyberOptics Corporation

Founded in 1984, CyberOptics is a recognized leader in process yield and throughput improvement solutions for the global electronics assembly and semiconductor capital equipment markets. Headquartered in Minneapolis, MN, CyberOptics conducts operations in North America, Asia and Europe. For more information, visit the company�s Web site at http://www.cyberoptics.com.

Aug 30, 2017 -

Multi-Reflection Suppression (MRS) Technology in SQ3000 3D AOI Featured at productronica India

Aug 23, 2017 -

Laser Design CyberGage®360, Automated 3D Scanning & Inspection System Adopted by Proto Labs in Their State-of-the-Art Metrology Lab

Aug 15, 2017 -

CyberOptics to Demonstrate 3D AOI with Ultra-High Resolution MRS Sensor at SMTA International

Aug 01, 2017 -

CyberOptics Unveils SQ3000-DD™ 3D AOI with Dual MRS Sensors at NEPCON Shenzhen

Jun 07, 2017 -

CyberOptics to Demonstrate Yield-Improving WaferSense® & ReticleSense® Technology at SEMICON West

Apr 22, 2017 -

CyberOptics to Demonstrate Breakthrough Multi-Reflection Suppression (MRS) Sensor Technology at SMT/Hybrid/Packaging

Apr 06, 2017 -

Laser Design Demonstrates Automated CyberGage360 3D Scanning Inspection System at Control Show

Mar 07, 2017 -

CyberOptics to Demonstrate Advanced MRS-Enabled CyberGage360 3D Scanning Inspection System at the UK Southern Manufacturing Show

Feb 07, 2017 -

CyberOptics Demonstrates Extended Sensing Capability in Airborne Particle Sensor Technology at SEMICON Korea

Jan 17, 2017 -

CyberOptics Advances Breakthrough Multi-Reflection Suppression (MRS) Sensor Technology to an Even Higher Resolution

143 more news from CyberOptics Corporation »

Sep 20, 2017 -

Viscom AG adopts Valor Process Preparation solution for electronics manufacturing efficiency

Sep 20, 2017 -

COT Announces PB Swiss Tools’ Two New INSIDER Models: INSIDER STUBBY and INSIDER STUBBY RATCHET

Sep 20, 2017 -

New IPC Studies Show World PCB Market Up in 2016 as North American Market Shrinkage Slows World PCB Production and Annual North American PCB Industry Reports Released

Sep 20, 2017 -

ADLINK Technology invites clients to join the MEC Congress 2017

Sep 19, 2017 -

ASC International to Highlight 3D AOI/SPI Innovations at SMTA International

Sep 19, 2017 -

MicroCare Presents Radically Innovative ‘Greener’ Cleaning Fluid at Parts2Clean Stuttgart Hall 3 Stand A46

Sep 19, 2017 -

Aegis Software’s FactoryLogix a major step on Melecs journey towards Industry 4.0

Sep 19, 2017 -

IPC Invites Industry Leaders to Submit Poster Abstracts for IPC APEX EXPO 2018 in San Diego

Sep 19, 2017 -

SCS Webinar to Address the Use of Parylene for Increased Reliability

Sep 19, 2017 -

BTU Introduces Profile Guardian Redundant Process Monitor during SMTAI

See electronics manufacturing industry news »

CyberOptics to Feature SE 300 Ultra� 3-D Solder Paste Inspection at Nepcon Shanghai 2008 news release has been viewed 651 times

  • SMTnet
  • »
  • Industry News
  • »
  • CyberOptics to Feature SE 300 Ultra� 3-D Solder Paste Inspection at Nepcon Shanghai 2008
ii-feed SMD Intelligent Feeder

Fluid Dispense Pump Integration