Designed for integrated manufacturing and process optimisation, Europa Vi delivers extended flexible substrate image size range from 1.50" x 2.00" (38mm x 50mm) up to 24" x 24" (610mm x 610mm), a 30% increase over the standard Europa platform. The systems is also able to handle large board products up to 16.5lb (7.5kg) in weight and 0.236" (6mm) thick, and features heavy duty remote board stops.
Europa Vi accommodates DEK�s latest suite of award-winning Instinctiv productivity tools. Instinctiv majors on ease-of-use and ensures simple operator transition from other platforms. Product size conversion to large boards is enabled by fully adjustable transport rails and a two-speed board transport control system with software time lag control. The platform is pre-configured with an upgraded understencil cleaner deploying a 4-stage head providing cleaning for a 24" (610mm) wide image using wet, vacuum and dry strokes. A vacuum filtration unit is also included.
Consumables for the Europa Vi include longer board clamps that support 25" of Squeegee and Stencil foil to reduce paste wastage and increase stencil foil life. Board clamps are available as standard Over-the-Top clamps, foiless clamps or edge clamps (snuggers). System options include upgraded VectorGuard� frames of 31" x 33" (787mm x 838mm) size to take advantage of the enlarged print area. VectorGuard foils are available in 0.005" (0.13mm) and 0.006" (0.15mm) thicknesses. In addition, side bars can be used to adapt the large print area down to the standard 29" x 29" (736mm x 736mm) VectorGuard format.
DEK�s new Europa Vi platform delivers the stability, accuracy, repeatability and flexibility required to maximise output in manufacturing environments that need to accommodate a diverse range of substrate sizes. The platform future-proofs tomorrow�s large substrate technology in the key areas of advanced technology backplanes, solar and fuel cell panels and multi-up substrate printing.
DEK is a global provider of advanced materials deposition technologies and support solutions including printing equipment platforms, stencils, precision screens and mass imaging processes used across a wide range of applications in electronics pre-placement subassembly, semiconductor wafer manufacture, and alternative energy component production. For more information, visit DEK at http://www.dek.com