Mar 26, 2008
We expect to see similar trends in 2007. Demand for our products (inspection and rework) will be a mixture of capacity expansion and new facilities. We plan to be better able to react to our customer demands when unplanned events take place or when important opportunities come up.
We also expect to see a rapid push for new components. We saw a slight slow down in new components as industry took on lead free assembly. Now we are seeing a number of new types of product such as Package on Package (POP), larger boards, and new types of substrates. To respond, we plan to enhance both our R&D and Applications Support.
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