SMT, PCB Electronics Industry News

What's happening at MIRTEC in 2008?

Mar 25, 2008

The continuing trend toward the miniaturization of electronic packaging technologies is perhaps the most prolific driving force behind new AOI product development. The advent of 0201 and 01005 packages and the industry wide acceptance of BGA, CSP and a host of small outline ultra-fine-pitch IC devices have lead to ever increasing PCB density that, in turn, provides an equal level of complexity for the inspection process.

In order to contend with the complexity of today�s PCB assemblies, an AOI system must be extremely accurate and repeatable. Successful AOI manufacturers must place an emphasis on the design and development of technically advanced optics, lighting, and measurement systems necessary to achieve these absolute industry requirements.

With this in mind, MIRTEC is introduces its most technologically advanced AOI platform to the PCB manufacturing industry. Fully configured, the MV-7L in line AOI system provides one top down digital color camera with up to four mega pixel resolution and four two mega pixel side view cameras thus providing the necessary resolution to inspect 01005 components. The patented �Quad Angle Lighting System� of the MV-7L provides four independently programmable zones for optimal illumination of inspection areas.

The revolutionary Intelli-Scan Laser System provides �The Third Dimension in Inspection Capability,� the ability to precisely measure the Z-height of a given region of interest. This advanced technology provides:

  • Superior lifted lead detection for Gull Wing devices.

  • Four point height measurement capability for Coplanarity testing of BGA, and CSP devices.

  • Enhanced solder paste measurement capability.

We also offer the industry�s most advanced desktop AOI system. The MV-3L is the �World's First� Five Camera Desktop AOI system. The MV-3L uses the same exact optics and lighting system as the MV-7L to ensure 100 percent programming compatibility across the product line.

MIRTEC AOI systems bring unprecedented performance, quality and cost-effectiveness to the inspection environment. The system software is simple yet powerful. A comprehensive Package Type Library provides simple �Drag and Drop� component programming and the Automatic Teaching Tool (ATT) software provides automatic teaching of component locations using CAD centroid data. Typical programming time is under one hour per assembly. In addition our AOI solutions offer built in SPC data collection software which promotes continuous process improvement by allowing the user to track and eliminate defects on inspected assemblies. The objective is to provide our customers with a clear view into the manufacturing process, thereby helping them achieve higher operating efficiencies and improved quality.

Mar 29, 2018 -

MIRTEC Announces Corporate Partnership Agreement with Vectralis Engineering and USM Reps

Feb 28, 2018 -

MIRTEC WINS SERVICE EXCELLENCE AWARD FOR TEST AND INSPECTION FOUR YEARS IN A ROW!

Feb 02, 2018 -

Distributor YouSMT Strengthens Mirtec’s Presence in Italy

Jan 29, 2018 -

Norcott Technologies Purchases Mirtec’s MV-3 OMNI to Strengthen Its Inspection Capability

Jan 28, 2018 -

MIRTEC to Exhibit Complete Line of Technologically Advanced 3D AOI and SPI Inspection Systems at IPC APEX 20

Jan 18, 2018 -

MIRTEC Europe Celebrates 10 Years of Consistent Inspection Innovation

Jan 04, 2018 -

MIRTEC REPORTS RECORD SALES REVENUE FOR 2017

Nov 30, 2017 -

Mirtec Europe Appoints YouSMT as Its Italian Distributor

Nov 14, 2017 -

MIRTEC Receives Two Global Technology Awards during productronica for Its MV-3 OMNI Desktop 3D AOI System

Oct 17, 2017 -

Best Rated Cost, Flexibility & Technology – MIRTEC’s MV-6 OMNI 3D AOI System at productronica

139 more news from MIRTEC Corporation »

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ULT LLC cooperates with GulfTech

Apr 18, 2018 -

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Apr 18, 2018 -

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Apr 18, 2018 -

IPC Hand Soldering Competition Winner Crowned at Global Industrie/Midest 2018 in Paris

Apr 18, 2018 -

Koh Young Presenting on 3D Technologies at SMTA Rocky Mountain Chapter Technical Session

Apr 17, 2018 -

International Conference for Electronics Enabling Technologies (ICEET) Program Finalized

Apr 17, 2018 -

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Apr 17, 2018 -

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Apr 17, 2018 -

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Apr 17, 2018 -

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